发明申请
US20080255283A1 THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 审中-公开
热固性环氧树脂组合物和半导体器件

  • 专利标题: THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
  • 专利标题(中): 热固性环氧树脂组合物和半导体器件
  • 申请号: US12026433
    申请日: 2008-02-05
  • 公开(公告)号: US20080255283A1
    公开(公告)日: 2008-10-16
  • 发明人: Takayuki AokiTadaharu Ikeda
  • 申请人: Takayuki AokiTadaharu Ikeda
  • 优先权: JP2007-026508 20070206; JP2007-026659 20070206
  • 主分类号: C08K3/36
  • IPC分类号: C08K3/36 C08K5/05 H01L23/29 C08K5/06
THERMOSETTING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要:
A thermosetting epoxy resin composition is provided comprising (A) a reaction product obtained through reaction of a triazine derived epoxy resin with an acid anhydride, (C) a reflective agent, (D) an inorganic filler, and (E) a curing catalyst. In one embodiment, (B) an internal parting agent having a melting point of 50-90° C. is included. In another embodiment, (I) inorganic whisker fibers having an average fineness of 0.05-50 μm and an average length of 1.0-1,000 μm are included.
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