发明申请
US20080255315A1 Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin
有权
环氧树脂组合物，其固化物，半导体封装材料，新型酚醛树脂，新型环氧树脂，新型苯酚树脂生产方法，以及新型环氧树脂生产方法
- 专利标题： Epoxy Resin Composition,Cured Article Thereof, Semiconductor Sealing Material, Novel Phenol Resin, Novel Epoxy Resin,Method for Producing Novel Phenol Resin, And Method For Producing Novel Epoxy Resin
- 专利标题（中）： 环氧树脂组合物，其固化物，半导体封装材料，新型酚醛树脂，新型环氧树脂，新型苯酚树脂生产方法，以及新型环氧树脂生产方法
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申请号： US11661095申请日： 2005-08-31
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公开(公告)号： US20080255315A1公开(公告)日： 2008-10-16
- 发明人: Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
- 申请人： Ichiro Ogura , Yoshiyuki Takahashi , Kazuo Arita , Kunihiro Morinaga , Yutaka Satou
- 申请人地址： JP Tokyo
- 专利权人： Dainippon Ink and Chemicals, Inc.
- 当前专利权人： Dainippon Ink and Chemicals, Inc.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-254144 20040901; JP2004-254145 20040901
- 国际申请： PCT/JP05/15867 WO 20050831
- 主分类号： C08G59/00
- IPC分类号： C08G59/00 ; C08G65/38
摘要：
An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
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