发明申请
- 专利标题： Perforated soundproof structure and method of manfacturing the same
- 专利标题（中）： 穿孔隔音结构及其制作方法
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申请号： US11907687申请日： 2007-10-16
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公开(公告)号： US20080257642A1公开(公告)日： 2008-10-23
- 发明人: Ichiro Yamagiwa , Toshimitsu Tanaka , Hiroki Ueda , Hideo Utsuno , Toru Sakatani , Akio Sugimoto
- 申请人： Ichiro Yamagiwa , Toshimitsu Tanaka , Hiroki Ueda , Hideo Utsuno , Toru Sakatani , Akio Sugimoto
- 专利权人： Kabushiki Kaisha Kobe Seiko Sho.
- 当前专利权人： Kabushiki Kaisha Kobe Seiko Sho.
- 优先权： JP2001-188444 20010621; JP2001-188455 20010621
- 主分类号： E04B1/82
- IPC分类号： E04B1/82
摘要：
A perforated soundproof structure is formed by oppositely arranging an external plate 1 and an internal plate 2 having a number of through-holes 2a. The board thickness, hole diameter and open area ratio of the internal plate 2 are set to satisfy design conditions to give rise to a viscous effect in the air passing through the through-holes 2a, and the design conditions are set so that the frequency bandwidth to attain an absorption coefficient of 0.3 or more is 10% or more of the resonance frequency.
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