发明申请
- 专利标题： Process for Producing and Apparatus for Improving the Bonding Between a Plastic and a Metal
- 专利标题（中）： 用于改善塑料和金属之间的粘结的生产方法和装置
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申请号： US10575798申请日： 2004-10-01
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公开(公告)号： US20080258281A1公开(公告)日： 2008-10-23
- 发明人: Bernd Betz , Jochen Dangelmaier , Stefan Paulus
- 申请人： Bernd Betz , Jochen Dangelmaier , Stefan Paulus
- 优先权： DE10348715.8 20031016
- 国际申请： PCT/DE2004/002199 WO 20041001
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/306 ; H01L21/3105
摘要：
A semiconductor having a leadframe is disclosed. In one embodiment, a leadframe is disclosed to be fitted with a semiconductor chip and is to be encapsulated with a plastic compound has a metallic single-piece base body, to which an interlayer is applied. The interlayer has a surface including a matrix of islands of remaining material of substantially uniform height, with voids extending between said islands.
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