发明申请
- 专利标题: MULTI-WAFER 3D CAM CELL
- 专利标题(中): 多画面三维CAMCELL
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申请号: US11750676申请日: 2007-05-18
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公开(公告)号: US20080288720A1公开(公告)日: 2008-11-20
- 发明人: Jagreet S. Atwal , Joseph S. Barnes , Kerry Bernstein , Robert J. Bucki , Jason A. Cox
- 申请人: Jagreet S. Atwal , Joseph S. Barnes , Kerry Bernstein , Robert J. Bucki , Jason A. Cox
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: G06F12/00
- IPC分类号: G06F12/00 ; G11C15/04 ; H01L21/8239
摘要:
A multi-wafer CAM cell in which the negative effects of increased travel distance have been substantially reduced is provided. The multi-wafer CAM cell is achieved in the present invention by utilizing three-dimensional integration in which multiple active circuit layers are vertically stack and vertically aligned interconnects are employed to connect a device from one of the stacked layers to another device in another stack layer. By vertically stacking multiple active circuit layers with vertically aligned interconnects, each compare port of the inventive CAM cell can be implemented on a separate layer above or below the primary data storage cell. This allows the multi-wafer CAM structure to be implemented within the same area footprint as a standard Random Access Memory (RAM) cell, minimizing data access and match compare delays.