A semiconductor device is formed in a semiconductor layer. A gate dielectric is formed over a top surface of the semiconductor layer. A gate stack is over the gate dielectric. A sidewall spacer is formed around the gate stack. Using the sidewall spacer as a mask, an implant is performed to form deep source/drain regions in the semiconductor layer. Silicon carbon regions are formed on the deep source/drain regions and a top surface of the gate stack. The silicon carbon regions are silicided with nickel.