发明申请
US20080293341A1 METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING
审中-公开
用于衬底抛光的滚动支撑垫的方法和装置
- 专利标题： METHODS AND APPARATUS FOR USING A ROLLING BACKING PAD FOR SUBSTRATE POLISHING
- 专利标题（中）： 用于衬底抛光的滚动支撑垫的方法和装置
-
申请号： US12124147申请日： 2008-05-21
-
公开(公告)号： US20080293341A1公开(公告)日： 2008-11-27
- 发明人: Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
- 申请人： Eashwer Kollata , Shou-Sung Chang , Zhenhua Zhang , Paul D. Butterfield , Sen-Hou Ko , Antoine P. Manens , Gary C. Ettinger , Ricardo Martinez
- 申请人地址： US CA Santa Clara
- 专利权人： APPLIED MATERIALS, INC.
- 当前专利权人： APPLIED MATERIALS, INC.
- 当前专利权人地址： US CA Santa Clara
- 主分类号： B24B5/00
- IPC分类号： B24B5/00 ; B24B1/00
摘要：
An apparatus and method are provided to polish an edge of a substrate. The invention includes a polishing head including a backing pad, wherein a width of the backing pad that contacts the substrate edge is larger than a width of a notch in the substrate edge. Numerous other aspects are provided.
信息查询
