发明申请
- 专利标题: Material for Formation of Resist Protection Film and Method of Forming Resist Pattern Therewith
- 专利标题(中): 抗蚀剂保护膜形成材料及其形成方法
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申请号: US11658900申请日: 2005-07-29
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公开(公告)号: US20080311523A1公开(公告)日: 2008-12-18
- 发明人: Kotaro Endo , Masaaki Yoshida , Keita Ishizuka
- 申请人: Kotaro Endo , Masaaki Yoshida , Keita Ishizuka
- 优先权: JP2004-224810 20040730; JP2004-228695 20040804
- 国际申请: PCT/JP05/13975 WO 20050729
- 主分类号: G03F7/004
- IPC分类号: G03F7/004 ; G03F7/20
摘要:
In the liquid immersion lithography process, by simultaneously preventing deterioration of a resist film and deterioration of an immersion liquid employed during liquid immersion lithography which uses various immersion liquids, including water, resistance to post exposure delay of the resist film can be improved without increasing the number of processes, thereby making it possible to form a high resolution resist pattern using liquid immersion lithography. Furthermore, it is possible to apply a high refractive index liquid immersion medium, used in combination with the high refractive index liquid immersion medium, thus making it possible to further improve pattern accuracy. Using a composition comprising an acrylic resin component having characteristics which have substantially no compatibility with a liquid in which a resist film is immersed, particularly water, and are also soluble in alkaline, a protective film is formed on the surface of a resist film used.
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