Invention Application
US20090001057A1 Dual damascene trench depth detection and control using voltage impedance RF probe 审中-公开
使用电压阻抗RF探头进行双镶嵌深沟探测和控制

  • Patent Title: Dual damascene trench depth detection and control using voltage impedance RF probe
  • Patent Title (中): 使用电压阻抗RF探头进行双镶嵌深沟探测和控制
  • Application No.: US11824503
    Application Date: 2007-06-29
  • Publication No.: US20090001057A1
    Publication Date: 2009-01-01
  • Inventor: Cheng-Hsin MaJeff J. Xu
  • Applicant: Cheng-Hsin MaJeff J. Xu
  • Main IPC: B23K10/00
  • IPC: B23K10/00
Dual damascene trench depth detection and control using voltage impedance RF probe
Abstract:
In one embodiment, a system to measure changes and a dual damascene trench depth, comprises a power source, and impedance matching network coupled to the power source and to an electrode, a radio frequency sensor coupled to the impedance matching network, and a controller to establish a baseline correlation between a plasma impedance and the dual damascene trench depth, and use the baseline correlation to measure changes in the dual damascene trench depth.
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