An inspecting method includes registering a pre-obtained relationship between contact time of the probes with the target object having the predetermined temperature and tip positions of the probes which vary in accordance with the contact time. The method further includes inspecting the chips by estimating the tip positions of the probes based on the relationship and the contact time of the probes with the chips upon the inspection and then correcting the tip positions of the probes from previous tip positions based on the estimated values until the probes are stable without being extended or contracted during the inspection.