Invention Application
US20090013527A1 COLLAPSABLE CONNECTION MOLD REPAIR METHOD UTILIZING FEMTOSECOND LASER PULSE LENGTHS
审中-公开
使用FEMTOSECOND激光脉冲长度的可伸缩连接模具修复方法
- Patent Title: COLLAPSABLE CONNECTION MOLD REPAIR METHOD UTILIZING FEMTOSECOND LASER PULSE LENGTHS
- Patent Title (中): 使用FEMTOSECOND激光脉冲长度的可伸缩连接模具修复方法
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Application No.: US11775918Application Date: 2007-07-11
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Publication No.: US20090013527A1Publication Date: 2009-01-15
- Inventor: Timothy E. Neary , Erik M. Probstfield
- Applicant: Timothy E. Neary , Erik M. Probstfield
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H01R12/14
Abstract:
A method for repairing molds for collapsible connections utilizing a femtosecond laser pulse length. Also provided is a laser source for implementing a multistep profile repair process for the removal of excess material in C4 molds by utilizing the femtosecond laser pulse lengths.
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