发明申请
- 专利标题： SEMICONDUCTOR DEVICE
- 专利标题（中）： 半导体器件
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申请号： US11777694申请日： 2007-07-13
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公开(公告)号： US20090014871A1公开(公告)日： 2009-01-15
- 发明人: Thorsten Meyer , Markus Brunnbauer , Recai Sezi
- 申请人： Thorsten Meyer , Markus Brunnbauer , Recai Sezi
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/44
摘要：
A semiconductor device is disclosed. One embodiment includes a semiconductor substrate and at least two insulating elements located above the semiconductor substrate or above a mold compound embedding the semiconductor substrate. The at least two insulating elements have a first face facing the semiconductor substrate or the mold compound and a second face facing away from the semiconductor substrate or the mold compound. A conductive element for each of the at least two insulating elements extends from the first face of the insulating element to the second face of the insulating element.
公开/授权文献
- US09093322B2 Semiconductor device 公开/授权日：2015-07-28
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