发明申请
- 专利标题： WELDABLE CONTACT AND METHOD FOR THE PRODUCTION THEREOF
- 专利标题（中）： 焊接接头及其生产方法
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申请号： US11817554申请日： 2006-02-09
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公开(公告)号： US20090020325A1公开(公告)日： 2009-01-22
- 发明人: Robert Hammedinger , Konrad Kastner , Martin Maier , Michael Obesser
- 申请人： Robert Hammedinger , Konrad Kastner , Martin Maier , Michael Obesser
- 优先权： DE102005009358.2 20050301
- 国际申请： PCT/EP2006/001160 WO 20060209
- 主分类号： H05K3/34
- IPC分类号： H05K3/34 ; H05K1/18
摘要：
A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
公开/授权文献
- US08456022B2 Weldable contact and method for the production thereof 公开/授权日：2013-06-04
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