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公开(公告)号：US08456022B2
公开(公告)日：2013-06-04
申请号：US11817554
申请日：2006-02-09
CPC分类号： H05K1/111 , H01L24/03 , H01L24/05 , H01L2224/0401 , H01L2224/05557 , H01L2224/05558 , H01L2224/05559 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01061 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/19043 , H01L2924/351 , H05K3/244 , H05K2201/0373 , Y02P70/611 , Y10T29/49149 , H01L2924/00
摘要： A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
摘要翻译： 与电气部件一起使用的可焊接触头包括衬底上的焊盘金属化，以及至少部分焊盘金属化处的凸起下金属化。 凸块下金属化处于用于接收焊料的区域中。 衬垫金属化被构造成露出衬底表面的部分。 底部凸起金属化与衬底的部分直接接触。
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公开(公告)号：US20090020325A1
公开(公告)日：2009-01-22
申请号：US11817554
申请日：2006-02-09
CPC分类号： H05K1/111 , H01L24/03 , H01L24/05 , H01L2224/0401 , H01L2224/05557 , H01L2224/05558 , H01L2224/05559 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01051 , H01L2924/01057 , H01L2924/01061 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/19043 , H01L2924/351 , H05K3/244 , H05K2201/0373 , Y02P70/611 , Y10T29/49149 , H01L2924/00
摘要： A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.
摘要翻译： 与电气部件一起使用的可焊接触头包括衬底上的焊盘金属化，以及至少部分焊盘金属化处的凸起下金属化。 凸块下金属化处于用于接收焊料的区域中。 衬垫金属化被构造成露出衬底表面的部分。 底部凸起金属化与衬底的部分直接接触。
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公开(公告)号：US20100116531A1
公开(公告)日：2010-05-13
申请号：US12620027
申请日：2009-11-17
CPC分类号： H01L24/05 , H01L2224/0231 , H01L2224/0233 , H01L2224/0236 , H01L2224/0239 , H01L2224/024 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/05552 , H01L2224/05555 , H01L2924/01005 , H01L2924/0101 , H01L2924/01013 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01061 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1461 , H01L2924/19043 , H01L2924/351 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A component having a multilayer solderable or bondable connecting surface on a substrate is proposed, which, in addition to the electrically conductive pad metallization and the UBM metallization also has an electrically conductive stress compensation layer that is arranged between the substrate and the pad metallization or between the pad metallization and the UBM metallization. The insensitivity to stress of the connecting metallization is achieved by means of a stress compensation layer whose modulus of elasticity is less than that of the UBM metallization.
摘要翻译： 提出了在衬底上具有多层可焊接或可粘合的连接表面的部件，除了导电焊盘金属化和UBM金属化之外，还具有布置在衬底和衬垫金属化之间的导电应力补偿层，或者在 焊盘金属化和UBM金属化。 通过应力补偿层实现连接金属化应力的不敏感性，其弹性模量小于UBM金属化的弹性模量。
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