发明申请
- 专利标题： Auto Routing for Optimal Uniformity Control
- 专利标题（中）： 自动路由优化均匀性控制
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申请号： US11830519申请日： 2007-07-30
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公开(公告)号： US20090035883A1公开(公告)日： 2009-02-05
- 发明人: Jean Wang , Francis Ko , Henry Lo , Chi-Chun Hsieh , Amy Wang , Chih-Wei Lai , Chun-Hsien Lin
- 申请人： Jean Wang , Francis Ko , Henry Lo , Chi-Chun Hsieh , Amy Wang , Chih-Wei Lai , Chun-Hsien Lin
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
A method for improving within-wafer uniformity is provided. The method includes forming an electrical component by a first process step and a second process step, wherein the electrical component has a target electrical parameter. The method includes providing a first plurality of production tools for performing the first process step; providing a second plurality of production tools for performing the second process step; providing a wafer; performing the first process step on the wafer using one of the first plurality of production tools; and selecting a first route including a first production tool from the second plurality of production tools. A within-wafer uniformity of the target electrical parameter on the wafer manufactured by the first route is greater than a second route including a second production tool in the second plurality of production tools.
公开/授权文献
- US07767471B2 Auto routing for optimal uniformity control 公开/授权日：2010-08-03
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