Invention Application
US20090039484A1 Semiconductor device with semiconductor chip and method for producing it
有权
具有半导体芯片的半导体器件及其制造方法
- Patent Title: Semiconductor device with semiconductor chip and method for producing it
- Patent Title (中): 具有半导体芯片的半导体器件及其制造方法
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Application No.: US11834262Application Date: 2007-08-06
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Publication No.: US20090039484A1Publication Date: 2009-02-12
- Inventor: Joachim Mahler , Alfred Haimerl , Angela Kessler , Michael Bauer , Wolfgang Schober
- Applicant: Joachim Mahler , Alfred Haimerl , Angela Kessler , Michael Bauer , Wolfgang Schober
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/60
Abstract:
A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.
Public/Granted literature
- US07705436B2 Semiconductor device with semiconductor chip and method for producing it Public/Granted day:2010-04-27
Information query
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