发明申请
US20090039484A1 Semiconductor device with semiconductor chip and method for producing it
有权
具有半导体芯片的半导体器件及其制造方法
- 专利标题： Semiconductor device with semiconductor chip and method for producing it
- 专利标题（中）： 具有半导体芯片的半导体器件及其制造方法
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申请号： US11834262申请日： 2007-08-06
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公开(公告)号： US20090039484A1公开(公告)日： 2009-02-12
- 发明人: Joachim Mahler , Alfred Haimerl , Angela Kessler , Michael Bauer , Wolfgang Schober
- 申请人： Joachim Mahler , Alfred Haimerl , Angela Kessler , Michael Bauer , Wolfgang Schober
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/60
摘要：
A semiconductor chip has at least one first contact and one second contact on its top side and has connecting elements which are arranged jointly on a structure element and which connect the first contact and the second contact of the top side of the semiconductor chip to the external contacts.
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