发明申请
US20090046409A1 Capacitor-embedded printed circuit board and manufacturing method thereof
审中-公开
电容嵌入式印刷电路板及其制造方法
- 专利标题: Capacitor-embedded printed circuit board and manufacturing method thereof
- 专利标题(中): 电容嵌入式印刷电路板及其制造方法
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申请号: US12076651申请日: 2008-03-20
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公开(公告)号: US20090046409A1公开(公告)日: 2009-02-19
- 发明人: Young Do Kweon , Sung Yi , Hong-Won Kim
- 申请人: Young Do Kweon , Sung Yi , Hong-Won Kim
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0082676 20070817
- 主分类号: H01G4/005
- IPC分类号: H01G4/005 ; H01G7/00
摘要:
A capacitor-embedded printed circuit board and a method of manufacturing the printed circuit board are disclosed. The capacitor-embedded printed circuit board includes: an insulation layer, a first electrode formed on one side of the insulation layer, a second electrode formed on one side of the first electrode, a dielectric layer formed on one side of the second electrode, and a third electrode formed on one side of the dielectric layer. By forming the electrodes of the capacitor in a dual structure, deviations in contact area may be minimized between the second electrode and the dielectric layer, so that ultimately, errors in capacitance may be reduced.
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