发明申请
US20090046409A1 Capacitor-embedded printed circuit board and manufacturing method thereof 审中-公开
电容嵌入式印刷电路板及其制造方法

Capacitor-embedded printed circuit board and manufacturing method thereof
摘要:
A capacitor-embedded printed circuit board and a method of manufacturing the printed circuit board are disclosed. The capacitor-embedded printed circuit board includes: an insulation layer, a first electrode formed on one side of the insulation layer, a second electrode formed on one side of the first electrode, a dielectric layer formed on one side of the second electrode, and a third electrode formed on one side of the dielectric layer. By forming the electrodes of the capacitor in a dual structure, deviations in contact area may be minimized between the second electrode and the dielectric layer, so that ultimately, errors in capacitance may be reduced.
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