公开(公告)号：US09751216B2

公开(公告)日：2017-09-05

申请号：US14471706

申请日：2014-08-28

申请人： Hong Won Kim ,  Woo Sup Han ,  Yong Jae Kim

发明人： Hong Won Kim ,  Woo Sup Han ,  Yong Jae Kim

IPC分类号： B25J19/00 ,  B25J5/00 ,  B25J9/10 ,  B25J19/06 ,  B25J18/00

CPC分类号： B25J19/00 ,  B25J5/007 ,  B25J9/104 ,  B25J18/00 ,  B25J19/06 ,  Y10S901/27 ,  Y10T74/20329

摘要： A robot capable of communicating according to a gesture may include a plurality of link members, and an outer cover member surrounding the plurality of link members. The shape of the outer cover member is varied into a curved shape, when the outer cover member is adhered closely to the plurality of link members, according to the variation of the shapes of the plurality of link members.

公开(公告)号：US20140366676A1

公开(公告)日：2014-12-18

申请号：US14471706

申请日：2014-08-28

申请人： Hong Won KIM ,  Woo Sup HAN ,  Yong Jae KIM

发明人： Hong Won KIM ,  Woo Sup HAN ,  Yong Jae KIM

IPC分类号： B25J19/00 ,  B25J18/00

CPC分类号： B25J19/00 ,  B25J5/007 ,  B25J9/104 ,  B25J18/00 ,  B25J19/06 ,  Y10S901/27 ,  Y10T74/20329

摘要： Disclosed herein is a robot, which is capable of communicating according to a gesture. The robot includes a plurality of link members, and an outer cover member surrounding the plurality of link members. The shape of the outer cover member is varied into a curved shape, when the outer cover member is adhered closely to the plurality of link members, according to the variation of the shapes of the plurality of link members.

摘要翻译： 这里公开了一种能够根据手势进行通信的机器人。 机器人包括多个连杆构件和围绕多个连杆构件的外盖构件。 根据多个连杆部件的形状的变化，外盖部件的形状变化为弯曲形状，当外盖部件紧密地粘接到多个连杆部件时。

公开(公告)号：US20110162477A1

公开(公告)日：2011-07-07

申请号：US12985433

申请日：2011-01-06

申请人： Hong Won KIM ,  Woo Sup Han

发明人： Hong Won KIM ,  Woo Sup Han

IPC分类号： B25J17/00

CPC分类号： B25J9/06 ,  B25J19/0075 ,  Y10T74/20329

摘要： A robot forms a natural curved line through a thickness variation of an outer cover member such that a user feels friendly toward gestures expressed by the robot. The robot includes a plurality of link members, at least one joint hinge connecting the plurality of link members, and an outer cover member covering the plurality of link members and the at least one joint hinge, wherein, as the outer cover member gets close to the at least one joint hinge, the thickness of the outer cover member increases.

摘要翻译： 机器人通过外盖构件的厚度变化形成自然曲线，使得用户对于由机器人表达的手势感到友好。 机器人包括多个连杆构件，连接多个连杆构件的至少一个铰接铰链和覆盖多个连杆构件和至少一个铰链铰链的外盖构件，其中，随着外盖构件接近 所述至少一个关节铰链，所述外盖构件的厚度增加。

公开(公告)号：US20110099779A1

公开(公告)日：2011-05-05

申请号：US12929234

申请日：2011-01-10

申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/09672 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49167

摘要： A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

摘要翻译： 一种制造电容器嵌入式印刷电路板的方法，其包括制造具有形成在电介质层的一侧上的至少一个内部电极的电容器基板; 将半固化绝缘层与芯层的一侧对准，并将电容器基板与半固化绝缘层对准，使得内电极面向半固化绝缘层; 并且集中地堆叠芯层，半固化绝缘层和电容器基板。

公开(公告)号：US20100139029A1

公开(公告)日：2010-06-10

申请号：US12591052

申请日：2009-11-05

申请人： Hong Won Kim

发明人： Hong Won Kim

IPC分类号： A47L5/00 ,  B60B19/00

CPC分类号： A47L9/009 ,  A47L2201/00

摘要： Disclosed is a wheel assembly capable of preventing a floor from being contaminated due to dust or impurities existing on driving wheels that move a body case. The wheel assembly includes a driving wheel that moves a body case in at least one direction, and at least one dust separator having an inclination angle with respect to an axial center line of the driving wheel to separate dust from the driving wheel.

摘要翻译： 公开了一种车轮组件，其能够防止由于存在于移动主体壳体的驱动轮上的灰尘或杂质而导致的地板受到污染。 车轮组件包括：至少一个方向移动主体壳体的驱动轮和至少一个相对于驱动轮的轴线中心线具有倾斜角度的灰尘分离器，以将灰尘与驱动轮分离。

公开(公告)号：US20080110669A1

公开(公告)日：2008-05-15

申请号：US11976760

申请日：2007-10-26

申请人： Hwa Sun Park ,  Tae Eui Kim ,  Jong Kuk Hong ,  Sang Jin Baek ,  Hong Won Kim ,  Jin Soo Jeong

发明人： Hwa Sun Park ,  Tae Eui Kim ,  Jong Kuk Hong ,  Sang Jin Baek ,  Hong Won Kim ,  Jin Soo Jeong

IPC分类号： H05K1/16 ,  H05K3/30

CPC分类号： H05K1/167 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4644 ,  H05K2201/09481 ,  Y10T29/435 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

摘要： Disclosed herein is a Printed Circuit Board (PCB) having embedded resistors and a method of manufacturing the same, in which contact pads are formed by filling via holes formed on electrode pads with oxidation-resistant conductive material, and resistors are formed on the contact pads. Accordingly, erosion that occurs between the electrode pads and the resistors can be prevented using the contact pads made of oxidation-resistant conductive material, and connections between circuits also can be realized. Furthermore, resistors are formed on a flat plane without any difference in height, attributable to the electrode pads, and thus differences between the resistance values of the built-in resistors can be greatly reduced.

摘要翻译： 本文公开了具有嵌入式电阻器的印刷电路板（PCB）及其制造方法，其中通过在电极焊盘上形成的具有抗氧化导电材料的孔填充形成接触焊盘，并且在接触焊盘上形成电阻器 。 因此，可以使用由抗氧化导电材料制成的接触垫来防止在电极焊盘和电阻器之间发生的侵蚀，并且还可以实现电路之间的连接。 此外，电阻器形成在平面上，由于电极焊盘而在高度上没有任何差异，因此可以大大降低内置电阻器的电阻值之间的差异。

公开(公告)号：US08893380B2

公开(公告)日：2014-11-25

申请号：US12320492

申请日：2009-01-27

申请人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

发明人： Hong Won Kim ,  Sung Yi ,  Tae Sung Jeong ,  Joon Seok Kang

IPC分类号： H05K3/30 ,  H01L23/00 ,  H05K1/18 ,  H01L21/683 ,  H05K3/42

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/18 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01059 ,  H01L2924/01078 ,  H05K3/426 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2203/1461 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49165

摘要： The present invention relates to a chip embedded printed circuit board and a manufacturing method thereof and provides a chip embedded printed circuit board including: an insulating layer having vias formed therethrough; a first chip and a second chip embedded in the insulating layer and having pads, which are respectively exposed to upper and lower surfaces of the insulating layer, on one surfaces thereof; an upper pattern formed on the upper surface of the insulating layer to be connected to the pads of the first chip and the vias; and a lower pattern formed on the lower surface of the insulating layer to be connected to the pads of the second chip and the vias. Also, the present invention provides a manufacturing method of a chip embedded printed circuit board.

摘要翻译： 芯片嵌入式印刷电路板及其制造方法技术领域本发明涉及一种芯片嵌入式印刷电路板及其制造方法，其特征在于，提供一种芯片嵌入式印刷电路基板， 嵌入绝缘层中的第一芯片和第二芯片，并且在其一个表面上分别暴露于绝缘层的上表面和下表面的焊盘; 形成在绝缘层的上表面上以连接到第一芯片的焊盘和通孔的上部图案; 以及形成在绝缘层的下表面上以连接到第二芯片的焊盘和通孔的下图案。 另外，本发明提供一种嵌入式芯片的印刷电路板的制造方法。

公开(公告)号：US08626490B2

公开(公告)日：2014-01-07

申请号：US12984120

申请日：2011-01-04

申请人： Hong Won Kim ,  Woo Sup Han

发明人： Hong Won Kim ,  Woo Sup Han

IPC分类号： G10L15/18

CPC分类号： G10L15/1822 ,  G06F17/28 ,  G10L15/1815

摘要： A dialogue system uses an extended domain in order to have a dialogue with a user using natural language. If a dialogue pattern actually input by the user is different from a dialogue pattern predicted by an expert, an extended domain generated in real time based on user input is used and an extended domain generated in advance is used to have a dialogue with the user.

摘要翻译： 对话系统使用扩展域，以便与使用自然语言的用户进行对话。 如果用户实际输入的对话模式与专家预测的对话模式不同，则使用基于用户输入实时生成的扩展域，并且使用预先生成的扩展域与用户进行对话。

公开(公告)号：US20110127076A1

公开(公告)日：2011-06-02

申请号：US12692413

申请日：2010-01-22

申请人： Hong Won KIM ,  Tae Sung JEONG

发明人： Hong Won KIM ,  Tae Sung JEONG

IPC分类号： H05K1/00 ,  H05K3/30 ,  H05K1/16

CPC分类号： H05K3/306 ,  H01L24/24 ,  H01L2224/24227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/185 ,  H05K3/007 ,  Y10T29/49139 ,  Y10T29/49146 ,  H01L2924/00

摘要： Disclosed herein is an electronic component-embedded printed circuit board, including: a base plate having a cavity formed therein in a thickness direction thereof; an electronic component which is disposed in the cavity such that an active surface of the electronic component is flush with one side of the base plate; an insulating material layer which is formed on the other side of the base plate to bury the electronic component; and a first circuit layer which is formed on one side of the base plate and includes connection patterns coming into contact with connecting terminals of the electronic component, and a method of manufacturing the same. The electronic component-embedded printed circuit board is advantageous in that the active surface of an electronic component is disposed such that it is flush with one side of a base plate, so that additional viaholes do not need to be formed, with the result that a laser process requiring high cost can be omitted, thereby simplifying the manufacturing process of a printed circuit board and reducing the manufacturing cost thereof.

摘要翻译： 这里公开了一种电子部件嵌入式印刷电路板，包括：基板，其厚度方向形成有空腔; 电子部件，其设置在所述空腔中，使得所述电子部件的有效表面与所述基板的一侧齐平; 绝缘材料层，其形成在所述基板的另一侧以埋置所述电子部件; 以及第一电路层，其形成在所述基板的一侧，并且包括与所述电子部件的连接端子接触的连接图案及其制造方法。 电子部件嵌入式印刷电路板的优点在于，电子部件的有源表面被设置为与基板的一侧齐平，使得不需要形成附加的通孔，结果是 可以省略需要高成本的激光工艺，从而简化印刷电路板的制造工艺并降低其制造成本。

公开(公告)号：US20110097856A1

公开(公告)日：2011-04-28

申请号：US12632611

申请日：2009-12-07

申请人： Hong Won KIM ,  Joon Seok Kang ,  Doo Sung Jung ,  Seon Hee Moon

发明人： Hong Won KIM ,  Joon Seok Kang ,  Doo Sung Jung ,  Seon Hee Moon

IPC分类号： H01L21/56

CPC分类号： H01L23/562 ,  H01L21/568 ,  H01L23/3171 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

摘要： Disclosed is a method of manufacturing a wafer level package, which includes arranging semiconductor dies on a carrier, forming a protective layer between the semiconductor dies of the carrier through screen printing, primarily heat hardening the protective layer, simultaneously pressing and secondarily heat hardening the protective layer, and removing the carrier, so that a thickness difference between the semiconductor dies and the protective layer is not formed and the warping of the wafer level package is reduced.

摘要翻译： 公开了一种制造晶片级封装的方法，其包括在载体上布置半导体管芯，通过丝网印刷在载体的半导体管芯之间形成保护层，主要将保护层加热硬化，同时加压硬化保护层 层，并且移除载体，使得半导体管芯和保护层之间的厚度差不会形成，并且晶片级封装的翘曲减小。