发明申请
- 专利标题： CASE STRUCTURE HAVING CONDUCTIVE PATTERN AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 具有导电图案的壳体结构及其制造方法
-
申请号： US12185341申请日： 2008-08-04
-
公开(公告)号： US20090051602A1公开(公告)日： 2009-02-26
- 发明人: Dae Seong Jeon , Sang Woo Bae , Jae Suk Sung
- 申请人： Dae Seong Jeon , Sang Woo Bae , Jae Suk Sung
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR10-2007-084429 20070822
- 主分类号： H01R13/46
- IPC分类号： H01R13/46 ; H01Q1/38 ; B05D5/12
摘要：
There is provided a case structure having a conductive pattern and a method of manufacturing the same. A case structure having a conductive pattern according to an aspect of the invention includes a case having at least one via hole formed therein; at least conductive pattern formed on an outer surface of the case; and a conductive via formed within the via hole and electrically connecting the at least one conductive pattern to a board inside the case.
公开/授权文献
信息查询
