Invention Application
- Patent Title: LIQUID EJECTION HEAD, LIQUID EJECTION APPARATUS, AND MANUFACTURING METHOD OF LIQUID EJECTION HEAD
- Patent Title (中): 液体喷射头,液体喷射装置和液体喷射头的制造方法
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Application No.: US12264772Application Date: 2008-11-04
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Publication No.: US20090056768A1Publication Date: 2009-03-05
- Inventor: Takeo EGUCHI , Shogo Ono , Kazuyasu Takenaka , Atsushi Nakamura , Yuichiro Ikemoto , Shigeyoshi Hirashima , Atsushi Nakayama , Shota Nishi , Yuji Yakura , Shigeyoshi Fujiki , Manabu Matsuda
- Applicant: Takeo EGUCHI , Shogo Ono , Kazuyasu Takenaka , Atsushi Nakamura , Yuichiro Ikemoto , Shigeyoshi Hirashima , Atsushi Nakayama , Shota Nishi , Yuji Yakura , Shigeyoshi Fujiki , Manabu Matsuda
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Priority: JP2005-162340 20050602; JP2005-237000 20050817; JP2005-248291 20050829
- Main IPC: B08B3/04
- IPC: B08B3/04

Abstract:
A liquid ejection head includes an energy-generating element arranged on a semiconductor substrate, a barrier layer deposited on the semiconductor substrate for forming a liquid chamber in the periphery of the energy-generating element, and a nozzle sheet bonded on the barrier layer and having a nozzle formed at a position opposing the energy-generating element, in which the liquid ejection head ejects liquid contained in the liquid chamber from the nozzle as liquid droplets by the energy-generating element, and the barrier layer is provided with a plurality of depressions, each having an independent contour, arranged within a range, which is separated from the border of the barrier layer, on an adhesive region adhering to the nozzle sheet.
Public/Granted literature
- US08210641B2 Liquid ejection head, liquid ejection apparatus, and manufacturing method of liquid ejection head Public/Granted day:2012-07-03
Information query
IPC分类: