- 专利标题： Electrochemical Fabrication Methods Incorporating Dielectric Materials and/or Using Dielectric Substrates
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申请号： US12189745申请日： 2008-08-11
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公开(公告)号： US20090064495A1公开(公告)日： 2009-03-12
- 发明人: Adam L. Cohen , Gang Zhang , Fan-Gang Tseng
- 申请人： Adam L. Cohen , Gang Zhang , Fan-Gang Tseng
- 专利权人： University of Southern California
- 当前专利权人： University of Southern California
- 主分类号： H05K3/10
- IPC分类号： H05K3/10
摘要：
Various embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer. In other embodiments, electrochemically fabricated structures are formed on dielectric substrates.
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