发明申请
- 专利标题: PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF
- 专利标题(中): 包装集成电路及其形成方法
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申请号: US11853461申请日: 2007-09-11
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公开(公告)号: US20090065931A1公开(公告)日: 2009-03-12
- 发明人: Sudarshan V. Rangaraj , Sanka Ganesan , Dongming He , Richard J. Harries , Sairam Agraharam
- 申请人: Sudarshan V. Rangaraj , Sanka Ganesan , Dongming He , Richard J. Harries , Sairam Agraharam
- 申请人地址: US CA Santa Clara
- 专利权人: INTEL CORPORATION
- 当前专利权人: INTEL CORPORATION
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L23/52
- IPC分类号: H01L23/52 ; H01L21/44
摘要:
Disclosed is a packaged integrated circuit and a method of forming thereof. The packaged integrated circuit includes a substrate, a plurality of solder bumps, a semiconductor die and a plurality of copper bumps. The plurality of solder bumps are configured on the substrate. Each of the plurality of solder bumps has a height of about 40 micrometers (μm) to about 65 μm. Further, the plurality of copper bumps are configured on the semiconductor die. Each of the plurality of copper bumps has a height of about 10 μm to about 25 μm. The semiconductor die is disposed above the substrate such that the plurality of copper bumps are coupled to the plurality of solder bumps, which in turn, couples the semiconductor die to the substrate.
公开/授权文献
- US3207758A Certain 2-(benzenesulfonamido)-5-alkoxypyrimidines 公开/授权日:1965-09-21