发明申请
US20090066350A1 WIRELESS INTERFACE PROBE CARD FOR HIGH SPEED ONE-SHOT WAFER TEST AND SEMICONDUCTOR TESTING APPARATUS HAVING THE SAME
有权
用于高速单波长测试的无线接口探测卡和具有相同功能的半导体测试设备
- 专利标题： WIRELESS INTERFACE PROBE CARD FOR HIGH SPEED ONE-SHOT WAFER TEST AND SEMICONDUCTOR TESTING APPARATUS HAVING THE SAME
- 专利标题（中）： 用于高速单波长测试的无线接口探测卡和具有相同功能的半导体测试设备
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申请号： US12200716申请日： 2008-08-28
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公开(公告)号： US20090066350A1公开(公告)日： 2009-03-12
- 发明人: Sang-Hoon LEE , Kwang-Yong LEE , Se-Jang OH , Young-Soo AN
- 申请人： Sang-Hoon LEE , Kwang-Yong LEE , Se-Jang OH , Young-Soo AN
- 申请人地址： KR Gyeonggi-do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Gyeonggi-do
- 优先权： KR2007-0091224 20070907
- 主分类号： G01R1/073
- IPC分类号： G01R1/073
摘要：
A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.
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