WIRELESS INTERFACE PROBE CARD FOR HIGH SPEED ONE-SHOT WAFER TEST AND SEMICONDUCTOR TESTING APPARATUS HAVING THE SAME
    1.
    发明申请
    WIRELESS INTERFACE PROBE CARD FOR HIGH SPEED ONE-SHOT WAFER TEST AND SEMICONDUCTOR TESTING APPARATUS HAVING THE SAME 有权
    用于高速单波长测试的无线接口探测卡和具有相同功能的半导体测试设备

    公开(公告)号:US20090066350A1

    公开(公告)日:2009-03-12

    申请号:US12200716

    申请日:2008-08-28

    IPC分类号: G01R1/073

    CPC分类号: G01R31/2889 G01R31/3025

    摘要: A wireless interface probe card includes a substrate member and a transmission member. The substrate member has a plurality of probe terminals arranged at a constant pitch. The probe terminals may directly contact a plurality of pads arranged at a constant pitch on each of a plurality of semiconductor chips arranged on a wafer to perform a test of the semiconductor chips arranged on the wafer. The transmission member is arranged on the substrate member, wirelessly receives a test signal and provides the received test signal to the pads of the wafer through the probe terminals, and wirelessly and externally transmits an electrical characteristic signal provided from the pads of the wafer through the probe terminals.

    摘要翻译: 无线接口探针卡包括基板部件和传输部件。 基板构件具有以恒定间距排列的多个探针端子。 探针端子可以直接接触布置在晶片上的多个半导体芯片中的每一个上以恒定间距布置的多个焊盘,以对布置在晶片上的半导体芯片进行测试。 传输构件布置在基板构件上,无线地接收测试信号,并通过探针端子将接收到的测试信号提供给晶片的焊盘,并且通过以下方式无线地和外部地传输从晶片的焊盘提供的电特性信号 探头端子。