发明申请
- 专利标题： Substrate processing apparatus, substrate transfer apparatus, substrate clamp apparatus, and chemical liquid treatment apparatus
- 专利标题（中）： 基板处理装置，基板输送装置，基板夹紧装置和药液处理装置
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申请号： US11665963申请日： 2007-02-21
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公开(公告)号： US20090067959A1公开(公告)日： 2009-03-12
- 发明人: Nobuyuki Takahashi , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
- 申请人： Nobuyuki Takahashi , Hiroaki Nishida , Hiroomi Torii , Soichi Isobe , Tadakazu Sone , Ryuichi Kosuge , Hiroyuki Kaneko , Hiroshi Sotozaki , Takao Mitsukura , Takahiro Ogawa , Kenichi Sugita
- 优先权： JP2006-046002 20060222
- 国际申请： PCT/JP07/53699 WO 20070221
- 主分类号： H01L21/67
- IPC分类号： H01L21/67
摘要：
The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).
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