Invention Application
- Patent Title: Adhesion promoter
- Patent Title (中): 粘合促进剂
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Application No.: US11919904Application Date: 2006-03-29
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Publication No.: US20090068362A1Publication Date: 2009-03-12
- Inventor: Harry J. Bahls
- Applicant: Harry J. Bahls
- Applicant Address: US MN Minneapolis
- Assignee: Valspar Sourcing, Inc.
- Current Assignee: Valspar Sourcing, Inc.
- Current Assignee Address: US MN Minneapolis
- International Application: PCT/US2006/011521 WO 20060329
- Main IPC: C03C17/40
- IPC: C03C17/40 ; B05D3/10

Abstract:
The present invention refers to a method of making an copper-free article having a metal coating deposited on a substrate comprising: providing a substrate; contacting a surface of said substrate with a solution comprising: at least one metal ion selected from the group consisting of Ce, Pr, Nd, Eu, Er, Ga, W, Al, Mn, Mo, Sb, Te, La, Sm or their mixtures; and applying a metal coating on said surface of said substrate. In another embodiment the present invention refers to a method of making a metal coated article: providing a substrate; contacting a surface of said substrate with a solution comprising a mixture of more than one metal ion selected from the same group as listed above; or contacting said surface of said substrate with more than one solution comprising in each solution at least one metal ion selected from the same group; and applying a metal coating on said surface of said substrate. Moreover, the present invention refers to a method of making a metal coated article comprising: providing a substrate; contacting a surface of said substrate with a solution comprising a Bi metal ion, and applying a metal coating on said activated surface of said substrate. Furthermore an article obtainable by any of said methods, is claimed.
Public/Granted literature
- US08623460B2 Adhesion promoter Public/Granted day:2014-01-07
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