发明申请
- 专利标题： SUBSTRATE TREATMENT APPARATUS
- 专利标题（中）： 基板处理设备
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申请号： US12207809申请日： 2008-09-10
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公开(公告)号： US20090081009A1公开(公告)日： 2009-03-26
- 发明人: Yuichi Yamamoto , Akihiro Teramoto , Wataru Tsukinoki
- 申请人： Yuichi Yamamoto , Akihiro Teramoto , Wataru Tsukinoki
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2007-243470 20070920; JP2008-137444 20080527
- 主分类号： H01L21/677
- IPC分类号： H01L21/677
摘要：
A substrate treatment apparatus is disclosed. The substrate treatment apparatus includes: a cassette loading portion on which a cassette for containing a substrate is loaded when the cassette is carried to/from outside of the substrate treatment apparatus; a substrate treatment portion for performing a treatment on the substrate; a substrate carrying portion for carrying the substrate in the cassette loaded on the cassette loading portion to the substrate treatment portion, and carrying the substrate that has been subjected to the treatment by the substrate treatment portion to the cassette on the cassette loading portion; a vacant cassette loading portion on which the cassette caused to be vacant by carrying the substrate to the substrate treatment portion is temporarily loaded; and a vacant cassette transfer mechanism for transferring the vacant cassette between the vacant cassette loading portion and the cassette loading portion.
公开/授权文献
- US08043039B2 Substrate treatment apparatus 公开/授权日：2011-10-25