发明申请
- 专利标题： TEMPERATURE SETTING METHOD OF THERMAL PROCESSING PLATE, COMPUTER-READABLE RECORDING MEDIUM RECORDING GPROGRAM THEREON, AND TEMPERATURE SETTING APPARATUS FOR THERMAL PROCESSING PLATE
- 专利标题（中）： 热处理板的温度设定方法，计算机可读记录介质记录介质及热处理板的温度设定装置
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申请号： US11858784申请日： 2007-09-20
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公开(公告)号： US20090082911A1公开(公告)日： 2009-03-26
- 发明人: Megumi JYOUSAKA , Hiroshi Tomita , Masahide Tadokoro
- 申请人： Megumi JYOUSAKA , Hiroshi Tomita , Masahide Tadokoro
- 申请人地址： JP Minato-ku
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Minato-ku
- 主分类号： G05D23/00
- IPC分类号： G05D23/00
摘要：
In the present invention, a thermal plate is divided into a plurality of thermal plate regions, and a temperature is settable for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the thermal plate is settable for each of the thermal plate regions of the thermal plate. The line widths within the wafer for which the photolithography process has been finished are first measured, and Zernike coefficients of a Zernike polynomial indicating a plurality of in-plane tendency components are calculated from the measured values of the line widths within the wafer. Then, the temperature correction values for the regions of the thermal plate to bring the calculated Zernike coefficients close to 0 are calculated using a calculation model indicating a correlation between change amounts of the Zernike coefficients and the temperature correction values. The temperature of each of the regions of the thermal plate is set based on each of the calculated temperature correction values.
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