发明申请
- 专利标题: Antifuse structures, antifuse array structures, methods of manufacturing the same
- 专利标题(中): 防污结构,反熔丝阵列结构,制造方法
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申请号: US12216094申请日: 2008-06-30
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公开(公告)号: US20090096060A1公开(公告)日: 2009-04-16
- 发明人: Deok-kee Kim , Yoon-dong Park , Seung-hoon Lee , I-hun Song , Won-joo Kim , Young-gu Jin , Hyuk-soon Choi , Suk-pil Kim
- 申请人: Deok-kee Kim , Yoon-dong Park , Seung-hoon Lee , I-hun Song , Won-joo Kim , Young-gu Jin , Hyuk-soon Choi , Suk-pil Kim
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 优先权: KR10-2007-0104060 20071016
- 主分类号: H01L29/00
- IPC分类号: H01L29/00 ; H01L21/00
摘要:
Antifuse structures, antifuse arrays, methods of manufacturing, and methods of operating the same are provided. An antifuse structure includes bitlines formed as first diffusing regions within a semiconductor substrate, an insulation layer formed on the bitlines, and wordlines formed on the insulation layer. An antifuse array includes a plurality of antifuse structures arranged in an array.
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