发明申请
- 专利标题: METHOD OF MANUFACTURING NON-SHRINKAGE CERAMIC SUBSTRATE AND NON-SHRINKAGE CERAMIC SUBSTRATE USING THE SAME
- 专利标题(中): 使用该方法制造非收缩陶瓷基板和非收缩陶瓷基板
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申请号: US12264883申请日: 2008-11-04
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公开(公告)号: US20090114434A1公开(公告)日: 2009-05-07
- 发明人: Min Ji Ko , Jong Myeon Lee , Eun Tae Park
- 申请人: Min Ji Ko , Jong Myeon Lee , Eun Tae Park
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHNICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHNICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2007-0112115 20071105
- 主分类号: H05K3/10
- IPC分类号: H05K3/10 ; H05K1/00
摘要:
There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same. A method of manufacturing a non-shrinkage ceramic substrate by firing a ceramic laminate including an internal electrode circuit pattern according to an aspect of the invention may include: laminating at least one constraining ceramic sheet on each of the upper and lower surfaces of the ceramic laminate to form constraining layers; performing a primary firing process on the ceramic laminate having the constraining layers thereon; polishing the surface of the ceramic laminate from which the constraining layers are removed; forming ceramic paste on the polished surface of the ceramic laminate while exposing connection terminals of the internal electrode circuit pattern to the outside environment through openings in the ceramic paste; forming a surface electrode on the surface of the ceramic paste by patterning so that the surface electrode is electrically connected to the connection terminals; and performing a secondary firing process so that the surface electrode adheres to the ceramic paste.
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