公开(公告)号：US20090114434A1

公开(公告)日：2009-05-07

申请号：US12264883

申请日：2008-11-04

申请人： Min Ji Ko ,  Jong Myeon Lee ,  Eun Tae Park

发明人： Min Ji Ko ,  Jong Myeon Lee ,  Eun Tae Park

IPC分类号： H05K3/10 ,  H05K1/00

CPC分类号： H05K3/4667 ,  H05K1/0306 ,  H05K3/1291 ,  H05K3/38 ,  H05K3/4611 ,  H05K2201/017 ,  H05K2203/025 ,  H05K2203/1126 ,  H05K2203/1476 ,  H05K2203/308

摘要： There is provided a method of manufacturing a non-shrinkage ceramic substrate, and a non-shrinkage ceramic substrate using the same. A method of manufacturing a non-shrinkage ceramic substrate by firing a ceramic laminate including an internal electrode circuit pattern according to an aspect of the invention may include: laminating at least one constraining ceramic sheet on each of the upper and lower surfaces of the ceramic laminate to form constraining layers; performing a primary firing process on the ceramic laminate having the constraining layers thereon; polishing the surface of the ceramic laminate from which the constraining layers are removed; forming ceramic paste on the polished surface of the ceramic laminate while exposing connection terminals of the internal electrode circuit pattern to the outside environment through openings in the ceramic paste; forming a surface electrode on the surface of the ceramic paste by patterning so that the surface electrode is electrically connected to the connection terminals; and performing a secondary firing process so that the surface electrode adheres to the ceramic paste.

摘要翻译： 提供了一种制造非收缩陶瓷基板的方法和使用其的非收缩陶瓷基板。 通过烧结根据本发明的一个方面的内部电极电路图案的陶瓷层压体制造非收缩陶瓷基板的方法可以包括：在陶瓷层压体的上表面和下表面的每一个上层叠至少一个约束陶瓷片 形成约束层; 在其上具有约束层的陶瓷层压板上进行初步烧制工艺; 抛光除去约束层的陶瓷层压体的表面; 在陶瓷层压板的抛光表面上形成陶瓷浆料，同时通过陶瓷膏中的开口将内部电极电路图案的连接端子暴露于外部环境; 通过图案化在陶瓷浆料的表面上形成表面电极，使得表面电极电连接到连接端子; 并进行二次烧成工序，使表面电极粘附在陶瓷糊上。

公开(公告)号：US07994084B2

公开(公告)日：2011-08-09

申请号：US12323840

申请日：2008-11-26

申请人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

发明人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

IPC分类号： C04B35/468 ,  H01G4/12

CPC分类号： H01G4/129 ,  B82Y30/00 ,  C04B35/468 ,  C04B2235/3281 ,  C04B2235/3298 ,  C04B2235/365 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  H01G4/1227 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.

摘要翻译： 提供一种电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷衬底。 电介质组合物包括约80重量％以上的主成分BaTiO 3和约20重量％以下的辅助成分CuBi 2 O 4和ZnO-B 2 O 3 -SiO 2基玻璃。

公开(公告)号：US20090141427A1

公开(公告)日：2009-06-04

申请号：US12323840

申请日：2008-11-26

申请人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

发明人： Soo Hyun Lyoo ,  Jong Myeon Lee ,  Ho Sung Choo ,  Min Ji Ko ,  Beom Joon Cho ,  Myung Whun Chang

IPC分类号： H01G4/12 ,  C04B35/468

CPC分类号： H01G4/129 ,  B82Y30/00 ,  C04B35/468 ,  C04B2235/3281 ,  C04B2235/3298 ,  C04B2235/365 ,  C04B2235/5445 ,  C04B2235/5454 ,  C04B2235/656 ,  C04B2235/6567 ,  C04B2235/9615 ,  H01G4/1227 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688

摘要： Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.

摘要翻译： 提供一种电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷衬底。 电介质组合物包括约80重量％以上的主成分BaTiO 3和约20重量％以下的辅助成分CuBi 2 O 4和ZnO-B 2 O 3 -SiO 2基玻璃。

公开(公告)号：US20110034606A1

公开(公告)日：2011-02-10

申请号：US12906540

申请日：2010-10-18

申请人： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

发明人： Eun Tae PARK ,  Yul Kyo Chung ,  Seung Hyun Sohn ,  Min Ji Ko

IPC分类号： C08K3/22

CPC分类号： H05K1/162 ,  H01G4/206 ,  H01L2924/0002 ,  H05K2201/0209 ,  H01L2924/00

摘要： Disclosed herein is a composite dielectric composition having a small variation of capacitance with temperature, comprising a combination of a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a negative or positive variation of capacitance with temperature which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor prepared by using the same composition. Particularly, the present invention provides a composite dielectric composition comprising a polymer matrix exhibiting a positive or negative variation of capacitance with temperature and a ceramic filler exhibiting a variation of capacitance which is reciprocal to that of the polymer matrix; and a signal-matching embedded capacitor formed of the same composition and having a variation of capacitance with temperature, ΔC/C×100(%), of not more than 5%. The composite dielectric composition of the present invention can be used in preparation of the signal-matching embedded capacitor due to a small variation of capacitance with temperature.

摘要翻译： 本文公开了一种具有小的电容变化与温度的复合电介质组合物，其包括表现出电容与温度的正或负变化的聚合物基体和陶瓷填料的组合，所述陶瓷填料表现出与温度成反比的电容的负或正变化 与聚合物基体的相同; 以及通过使用相同组成制备的信号匹配嵌入式电容器。 特别地，本发明提供一种复合电介质组合物，其包含显示电容与温度的正或负变化的聚合物基质和表现出与聚合物基体相反的电容变化的陶瓷填料; 以及具有相同组成并且具有不大于5％的电容与温度变化的信号匹配嵌入式电容器，并且Dgr; C / C×100（％）。 本发明的复合电介质组合物由于电容随温度的变化小而可用于制备信号匹配嵌入式电容器。

公开(公告)号：US07567426B2

公开(公告)日：2009-07-28

申请号：US11590800

申请日：2006-11-01

申请人： Min Ji Ko ,  Eun Tae Park

发明人： Min Ji Ko ,  Eun Tae Park

IPC分类号： H01G4/06

CPC分类号： H01G4/206 ,  H01G4/1209 ,  H01G4/33 ,  H05K1/162 ,  H05K2201/0209

摘要： Disclosed herein is a polymer-ceramic dielectric composition. The dielectric composition comprises a polymer and a ceramic dispersed in the polymer wherein the ceramic is composed of a material having a perovskite structure represented by ABO3 and a metal oxide dopant and has an electrically charged surface. According to the dielectric composition, the surface of the ceramic is electrically charged to induce space-charge polarization (or interfacial polarization) at the polymer/ceramic interface, resulting in an increase in dielectric constant. Since the dielectric composition has a high dielectric constant particularly in a low-frequency range, it can be suitably used to produce decoupling capacitors.

摘要翻译： 本文公开了一种聚合物 - 陶瓷电介质组合物。 电介质组合物包含分散在聚合物中的聚合物和陶瓷，其中陶瓷由具有由ABO 3表示的钙钛矿结构和金属氧化物掺杂剂的材料构成，并具有带电表面。 根据电介质组成，陶瓷的表面被充电以在聚合物/陶瓷界面处引起空间电荷极化（或界面极化），导致介电常数的增加。 由于电介质组合物具有高的介电常数，特别是在低频范围内，因此可适用于制造去耦电容器。

公开(公告)号：US20090159179A1

公开(公告)日：2009-06-25

申请号：US12340039

申请日：2008-12-19

申请人： Eun Tae Park ,  Min Ji Ko

发明人： Eun Tae Park ,  Min Ji Ko

IPC分类号： C03B29/00

CPC分类号： H05K3/4611 ,  B32B18/00 ,  C04B2235/6025 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/661 ,  C04B2237/32 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H05K1/0306 ,  H05K1/092 ,  H05K3/1291 ,  H05K3/4629 ,  H05K2203/1126 ,  H05K2203/1476 ,  H05K2203/308

摘要： A method of manufacturing a multilayer ceramic substrate according to an aspect of the invention may include: manufacturing a ceramic laminate including a glass component; laminating constraining layers on upper and lower parts of the ceramic laminate; performing primary firing within a first temperature range that does not allow crystallization of the glass component included in the ceramic laminate; removing the constraining layers and forming an external electrode on the ceramic laminate after the primary firing is completed; and performing secondary firing of the ceramic laminate having the external electrode formed thereon within a second temperature range higher than the first temperature range.

摘要翻译： 根据本发明的一个方面的多层陶瓷基板的制造方法可以包括：制造包括玻璃成分的陶瓷层叠体; 层压约束层在陶瓷层压板的上部和下部; 在不允许陶瓷层叠体中包含的玻璃成分结晶的第一温度范围内进行初次烧制; 在初次烧制完成之后，去除约束层并在陶瓷层压板上形成外部电极; 并且在高于第一温度范围的第二温度范围内对其上形成有外部电极的陶瓷层压体进行二次烧制。

公开(公告)号：US07531112B2

公开(公告)日：2009-05-12

申请号：US10875323

申请日：2004-06-25

申请人： Hyo Soon Shin ,  Jin Ho Kim ,  Jeong Joo Kim ,  Min Ji Ko

发明人： Hyo Soon Shin ,  Jin Ho Kim ,  Jeong Joo Kim ,  Min Ji Ko

IPC分类号： H01B1/00

CPC分类号： H05K1/162 ,  C08L101/12 ,  H01G4/206 ,  H05K2201/0209 ,  Y10T428/257

摘要： Disclosed is a composition for forming a dielectric, which is applied to an embedded capacitor with a high dielectric constant, a capacitor produced using the composition, and a PCB provided with the capacitor. The composition includes 40 to 99 vol % of thermoplastic or thermosetting resin, and 1 to 60 vol % of semiconductive filler. Alternatively, the composition includes 40 to 95 vol % of thermoplastic or thermosetting resin, and 5 to 60 vol % of semiconductive ferroelectric substance. Furthermore, the present invention provides the capacitor, produced using the composition, and the PCB provided with the capacitor. Therefore, the dielectric, which is produced using the composition including the semiconductive filler or semiconductive ferroelectric substance, is advantageous in that the dielectric constant is high and a dielectric loss is low. The dielectric is usefully applied to produce an embedded capacitor with the high dielectric constant and the PCB provided with the embedded capacitor.

摘要翻译： 公开了一种用于形成电介质的组合物，其被应用于具有高介电常数的嵌入式电容器，使用该组合物制造的电容器和设置有电容器的PCB。 该组合物包含40至99体积％的热塑性或热固性树脂和1至60体积％的半导体填料。 或者，该组合物包含40〜95体积％的热塑性或热固性树脂和5〜60体积％的半导体铁电体。 此外，本发明提供使用该组合物制造的电容器和设置有电容器的PCB。 因此，使用包含半导体填料或半导体铁电体的组合物制造的电介质的优点在于介电常数高，介电损耗低。 电介质有效地应用于制造具有高介电常数的嵌入式电容器和设置有嵌入式电容器的PCB。

公开(公告)号：US20110064952A1

公开(公告)日：2011-03-17

申请号：US12650801

申请日：2009-12-31

申请人： Min Ji Ko ,  Yong Seok Choi

发明人： Min Ji Ko ,  Yong Seok Choi

IPC分类号： B32B18/00 ,  B29C65/02 ,  B28B1/00 ,  B28B3/00

CPC分类号： B32B18/00 ,  C04B2235/9615 ,  C04B2237/32 ,  C04B2237/66 ,  Y10T428/31504

摘要： A method of fabricating a ceramic substrate includes: preparing a firing theta; forming a ceramic laminated body comprising at least one internal confinement layer on the ceramic theta; providing a temperature-compensation ceramic layer on at least one of a top surface of the ceramic laminated body and a bottom surface of the ceramic laminated body contacting the firing theta, the temperature-compensation ceramic layer having a different initial firing shrinkage temperature than the ceramic laminated body; and firing the ceramic laminated body.

摘要翻译： 制造陶瓷基板的方法包括：制备烧制θ; 形成陶瓷层压体，其包括在陶瓷θ上的至少一个内部限制层; 在陶瓷层叠体的上表面和陶瓷层叠体的与烧成点θ接触的底面中的至少一个上提供温度补偿陶瓷层，所述温度补偿陶瓷层的初始烧制收缩温度与陶瓷不同 层压体 并烧制陶瓷层压体。