发明申请
- 专利标题: Wiring Board and Method for manufacturing the Same
- 专利标题(中): 接线板及其制造方法
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申请号: US12264936申请日: 2008-11-05
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公开(公告)号: US20090114958A1公开(公告)日: 2009-05-07
- 发明人: Norio Nakazato , Nobuo Fujieda , Masayoshi Ishibashi , Midori Kato , Tadashi Arai , Takeo Shiba
- 申请人: Norio Nakazato , Nobuo Fujieda , Masayoshi Ishibashi , Midori Kato , Tadashi Arai , Takeo Shiba
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 优先权: JP2007-286865 20071105
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L21/311
摘要:
A wiring board with an electronic device comprising a plurality of trenches arranged in parallel on a substrate, a common trench communicating the plurality of trenches with each other at one of their ends on the substrate, a metal layer formed at the bottom of the plurality of trenches, and an electrode layer connected with the metal layer and formed on a bottom of the common trench, wherein the electrode layer on the bottom of the common trench constitutes a source electrode or a drain electrode of a field effect transistor, whereby the wiring board and an electronic circuit having a good fine wire pattern and a good narrow gap between the patterns using a coating material can be formed, and a reduction for a cost of an organic thin film electronic device and the electronic circuit can be attained since they can be realized through a development of a printing technique.
公开/授权文献
- US08120070B2 Wiring board and method for manufacturing the same 公开/授权日:2012-02-21