发明申请
- 专利标题： AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING METHOD, KIT FOR CHEMICAL MECHANICAL POLISHING, AND KIT FOR PREPARING AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING
- 专利标题（中）： 化学机械抛光，化学机械抛光方法，化学机械抛光工具和化学机械抛光水性分散工具的水性分散体
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申请号： US12295673申请日： 2007-03-27
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公开(公告)号： US20090124172A1公开(公告)日： 2009-05-14
- 发明人: Kazuhito Uchikura , Hirotaka Shida , Yuuichi Hashiguchi , Gaku Minamihara , Dai Fukushima , Yoshikuni Tateyama , Hiroyuki Yano
- 申请人： Kazuhito Uchikura , Hirotaka Shida , Yuuichi Hashiguchi , Gaku Minamihara , Dai Fukushima , Yoshikuni Tateyama , Hiroyuki Yano
- 申请人地址： JP Chuo-ku JP Minato-ku , Tokyo
- 专利权人： JSR CORPORATION,KABUSHIKI KAISHA TOSHIBA
- 当前专利权人： JSR CORPORATION,KABUSHIKI KAISHA TOSHIBA
- 当前专利权人地址： JP Chuo-ku JP Minato-ku , Tokyo
- 优先权： JP2006-101502 20060403
- 国际申请： PCT/JP2007/056495 WO 20070327
- 主分类号： B24B1/00
- IPC分类号： B24B1/00 ; C09K13/00 ; B24B7/20 ; B65D85/00 ; B65D85/84
摘要：
A chemical mechanical polishing aqueous dispersion comprises (A) abrasive grains, (B) at least one of quinolinecarboxylic acid and pyridinecarboxylic acid, (C) an organic acid other than quinolinecarboxylic acid and pyridinecarboxylic acid, (D) an oxidizing agent, and (E) a nonionic surfactant having a triple bond, the mass ratio (WB/WC) of the amount (WB) of the component (B) to the amount (WC) of the component (C) being 0.01 or more and less than 2, and the component (E) being shown by the following general formula (1), wherein m and n individually represent integers equal to or larger than one, provided that m+n≦50 is satisfied.
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