发明申请
US20090130414A1 Preparation of A Metal-containing Film Via ALD or CVD Processes 审中-公开
通过ALD或CVD工艺制备含金属膜

Preparation of A Metal-containing Film Via ALD or CVD Processes
摘要:
Methods for the deposition via chemical vapor deposition or atomic layer deposition of metal containing films, such as, for example, metal silicate or metal silicon oxynitride films are described herein. In one embodiment, the method for depositing a metal-containing film comprises the steps of introducing into a reaction chamber, a metal amide precursor, a silicon-containing precursor, and an oxygen source wherein each precursor is introduced after introducing a purge gas.
信息查询
0/0