Plasma enhanced cyclic deposition method of metal silicon nitride film
    1.
    发明申请
    Plasma enhanced cyclic deposition method of metal silicon nitride film 审中-公开
    金属氮化硅膜的等离子体增强循环沉积法

    公开(公告)号:US20080318443A1

    公开(公告)日:2008-12-25

    申请号:US12157631

    申请日:2008-06-12

    IPC分类号: H01L21/285 C23C16/34

    摘要: The present invention relates to a method for forming a metal silicon nitride film according to a cyclic film deposition under plasma atmosphere with a metal amide, a silicon precursor, and a nitrogen source gas as precursors. The deposition method for forming a metal silicon nitride film on a substrate comprises steps of: pulsing a metal amide precursor; purging away the unreacted metal amide; introducing nitrogen source gas into reaction chamber under plasma atmosphere; purging away the unreacted nitrogen source gas; pulsing a silicon precursor; purging away the unreacted silicon precursor; introducing nitrogen source gas into reaction chamber under plasma atmosphere; and purging away the unreacted nitrogen source gas.

    摘要翻译: 本发明涉及一种在金属酰胺,硅前体和氮源气体作为前体的等离子体气氛下,根据循环膜沉积形成金属氮化硅膜的方法。 用于在衬底上形成金属氮化硅膜的沉积方法包括以下步骤:脉冲金属酰胺前体; 清除未反应的金属酰胺; 在等离子体气氛下将氮源气体引入反应室; 清除未反应的氮源气体; 脉冲硅前体; 清除未反应的硅前体; 在等离子体气氛下将氮源气体引入反应室; 并清除未反应的氮源气体。

    Preparation of metal oxide thin film via cyclic CVD or ALD
    3.
    发明授权
    Preparation of metal oxide thin film via cyclic CVD or ALD 有权
    通过循环CVD或ALD制备金属氧化物薄膜

    公开(公告)号:US08092870B2

    公开(公告)日:2012-01-10

    申请号:US12410529

    申请日:2009-03-25

    IPC分类号: H05H1/24 C23C16/00

    CPC分类号: C23C16/409 C23C16/45553

    摘要: A cyclic deposition process to make a metal oxide film on a substrate, which comprises the steps: introducing a metal ketoiminate into a deposition chamber and depositing the metal ketoiminate on a heated substrate; purging the deposition chamber to remove unreacted metal ketominate and any byproduct; introducing an oxygen-containing source to the heated substrate; purging the deposition chamber to remove any unreacted chemical and byproduct; and, repeating the cyclic deposition process until a desired thickness of film is established.

    摘要翻译: 一种在衬底上形成金属氧化物膜的循环沉积工艺,其包括以下步骤:将金属酮亚胺引入淀积室并将金属酮嘧啶沉积在加热的衬底上; 清除沉积室以除去未反应的金属酮基甲酸酯和任何副产物; 将含氧源引入加热的基底; 清除沉积室以除去任何未反应的化学和副产物; 并重复循环沉积过程,直到建立所需的膜厚。

    Preparation of Metal Oxide Thin Film Via Cyclic CVD or ALD
    4.
    发明申请
    Preparation of Metal Oxide Thin Film Via Cyclic CVD or ALD 有权
    通过循环CVD或ALD制备金属氧化物薄膜

    公开(公告)号:US20100075067A1

    公开(公告)日:2010-03-25

    申请号:US12410529

    申请日:2009-03-25

    IPC分类号: B01J19/08 C23C16/44

    CPC分类号: C23C16/409 C23C16/45553

    摘要: A cyclic deposition process to make a metal oxide film on a substrate, which comprises the steps: introducing a metal ketoiminate into a deposition chamber and depositing the metal ketoiminate on a heated substrate; purging the deposition chamber to remove unreacted metal ketominate and any byproduct; introducing an oxygen-containing source to the heated substrate; purging the deposition chamber to remove any unreacted chemical and byproduct; and, repeating the cyclic deposition process until a desired thickness of film is established.

    摘要翻译: 一种在衬底上形成金属氧化物膜的循环沉积工艺,其包括以下步骤:将金属酮亚胺引入淀积室并将金属酮嘧啶沉积在加热的衬底上; 清除沉积室以除去未反应的金属酮基甲酸酯和任何副产物; 将含氧源引入加热的基底; 清除沉积室以除去任何未反应的化学和副产物; 并重复循环沉积过程,直到建立所需的膜厚。

    Group IV Metal Complexes For Metal-Containing Film Deposition
    6.
    发明申请
    Group IV Metal Complexes For Metal-Containing Film Deposition 有权
    用于含金属膜沉积的IV族金属络合物

    公开(公告)号:US20130030191A1

    公开(公告)日:2013-01-31

    申请号:US13362077

    申请日:2012-01-31

    IPC分类号: C07F7/00 C23C16/22 C07F7/28

    摘要: Metal-containing complexes with general formula (1) (R1nPyr)(R2nPyr)ML1L2; or (2) [(R8XR9)(R1nPyr)(R2nPyr)]ML1L2 are disclosed; wherein M is a Group IV metal, Pyr is pyrrolyl ligand, n=1, 2 and 3, L1 and L2 are independently selected from alkoxide, amide or alkyl, L1 and L2 can be linked together, R1 and R2 can be same or different organic groups substituted at 2,3,4-positions of the pyrrole ring and are selected from the group consisting of linear and branched C1-6 alkyls, Wand R9 are independently selected from the linear or branched chain alkylene group having 2-6 carbon atoms, and X is CH2 or oxygen. Methods of using the metal complexes as precursors to deposit metal or metal oxide films used for various devices in semi-conductor industries are also discussed.

    摘要翻译: 含有通式(1)(R1nPyr)(R2nPyr)的金属络合物ML1L2; 或(2)[(R8XR9)(R1nPyr)(R2nPyr)] ML1L2; 其中M是第IV族金属,Pyr是吡咯基配体,n = 1,2和3,L1和L2独立地选自烷氧基,酰胺或烷基,L1和L2可以连接在一起,R1和R2可以相同或不同 在吡咯环的2,3,4位被取代的有机基团,并且选自直链和支链C 1-6烷基,W 9和R 9独立地选自具有2-6个碳原子的直链或支链亚烷基 ,X为CH 2或氧。 还讨论了使用金属络合物作为前体沉积用于半导体工业中各种器件的金属或金属氧化物膜的方法。

    GROUP 4 METAL PRECURSORS FOR METAL-CONTAINING FILMS
    7.
    发明申请
    GROUP 4 METAL PRECURSORS FOR METAL-CONTAINING FILMS 有权
    第4组金属前驱物用于含金属膜

    公开(公告)号:US20110250126A1

    公开(公告)日:2011-10-13

    申请号:US12904421

    申请日:2010-10-14

    IPC分类号: C07F7/00 C01G23/047 C07F7/28

    摘要: The present invention is related to a family of Group 4 metal precursors represented by the formula: M(OR1)2(R2C(O)C(R3)C(O)OR1)2 wherein M is a Group 4 metals of Ti, Zr, or Hf; wherein R1 is selected from the group consisting of a linear or branched C1-10 alkyl and a C6-12 aryl, preferably methyl, ethyl or n-propyl; R2 is selected from the group consisting of branched C3-10 alkyls, preferably iso-propyl, tert-butyl, sec-butyl, iso-butyl, or tert-amyl and a C6-12 aryl; R3 is selected from the group consisting of hydrogen, C1-10 alkyls, and a C6-12 aryl, preferably hydrogen. In a preferred embodiment of this invention, the precursor is a liquid or a solid with a melting point below 60° C.

    摘要翻译: 本发明涉及由下式表示的第4族金属前体:M(OR1)2(R2C(O)C(R3)C(O)OR1)2,其中M是Ti,Zr的第4族金属 ,或Hf; 其中R 1选自直链或支链C 1-10烷基和C 6-12芳基,优选甲基,乙基或正丙基; R2选自支链C 3-10烷基,优选异丙基,叔丁基,仲丁基,异丁基或叔戊基和C 6-12芳基; R 3选自氢,C 1-10烷基和C 6-12芳基,优选氢。 在本发明的优选实施方案中,前体是熔点低于60℃的液体或固体。

    METHODS FOR DEPOSITION OF GROUP 4 METAL CONTAINING FILMS
    9.
    发明申请
    METHODS FOR DEPOSITION OF GROUP 4 METAL CONTAINING FILMS 审中-公开
    第4组金属膜的沉积方法

    公开(公告)号:US20110256314A1

    公开(公告)日:2011-10-20

    申请号:US12904461

    申请日:2010-10-14

    IPC分类号: C23C16/18

    摘要: A method for forming metal-containing films by atomic layer deposition using precursors of the formula: M(OR1)(OR2)(R3C(O)C(R4)C(O)XR5y)2 wherein M is Group 4 metals; wherein R1 and R2 can be same or different selected from the group consisting of a linear or branched C1-10 alkyl and a C6-12 aryl; R3 can be selected from the group consisting of linear or branched C1-10 alkyls, preferably C1-3 alkyls and a C6-12 aryl; R4 is selected from the group consisting of hydrogen, C1-10 alkyls, and a C6-12 aryl, preferably hydrogen; R5 is selected from the group consisting of C1-10 linear or branched alkyls, and a C6-12 aryl, preferably a methyl or ethyl group; X═O or N wherein when X═O, y=1 and R1, 2 and 5 are the same, when X═N, y=2 and each R5 can be the same or different.

    摘要翻译: 使用下式的M(OR1)(OR2)(R3C(O)C(R4)C(O)XR5y)2的前体通过原子层沉积形成含金属膜的方法,其中M是第4族金属; 其中R1和R2可以相同或不同,选自直链或支链C 1-10烷基和C 6-12芳基; R 3可以选自直链或支链C 1-10烷基,优选C 1-3烷基和C 6-12芳基; R 4选自氢,C 1-10烷基和C 6-12芳基,优选氢; R5选自C1-10直链或支链烷基,和C6-12芳基,优选甲基或乙基; X = O或N,其中当X = O,y = 1且R 1,2和5相同时,当X = N,y = 2,并且每个R 5可以相同或不同时。

    Precursors for Depositing Group 4 Metal-Containing Films
    10.
    发明申请
    Precursors for Depositing Group 4 Metal-Containing Films 有权
    用于沉积第4组含金属膜的前体

    公开(公告)号:US20100143607A1

    公开(公告)日:2010-06-10

    申请号:US12629416

    申请日:2009-12-02

    IPC分类号: C23C16/50 C23C16/44 C23C16/22

    摘要: Described herein are Group 4 metal-containing precursors, compositions comprising Group 4 metal-containing precursors, and deposition processes for fabricating conformal metal containing films on substrates. In one aspect, the Group 4 metal-containing precursors are represented by the following formula I: wherein M comprises a metal chosen from Ti, Zr, and Hf; R and R1 are each independently selected from an alkyl group comprising from 1 to 10 carbon atoms; R2 is an alkyl group comprising from 1 to 10 carbon atoms; R3 is chosen from hydrogen or an alkyl group comprising from 1 to 3 carbon atoms; R4 is an alkyl group comprising from 1 to 6 carbon atoms and wherein R2 and R4 are different alkyl groups. Also described herein are methods for making Group 4 metal-containing precursors and methods for depositing films using the Group 4 metal-containing precursors.

    摘要翻译: 本文描述的是含有第4族金属的前体,包含第4族金属的前体的组合物,以及用于在基材上制造含适形金属的膜的沉积工艺。 一方面,含4族金属的前体由下式I表示:其中M包括选自Ti,Zr和Hf的金属; R和R 1各自独立地选自包含1至10个碳原子的烷基; R 2是包含1至10个碳原子的烷基; R3选自氢或包含1至3个碳原子的烷基; R4是包含1至6个碳原子的烷基,其中R2和R4是不同的烷基。 本文还描述了制备含有第4族金属的前体的方法以及使用含有第4族金属的前体沉积膜的方法。