Invention Application
- Patent Title: SYSTEM INCLUDING AN INTER-CHIP COMMUNICATION SYSTEM
- Patent Title (中): 系统包括互通通讯系统
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Application No.: US11944720Application Date: 2007-11-26
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Publication No.: US20090134489A1Publication Date: 2009-05-28
- Inventor: Giorgio Chiozzi
- Applicant: Giorgio Chiozzi
- Applicant Address: DE Villach
- Assignee: INFINEON TECHNOLOGIES AUSTRIA AG
- Current Assignee: INFINEON TECHNOLOGIES AUSTRIA AG
- Current Assignee Address: DE Villach
- Main IPC: H01L23/02
- IPC: H01L23/02 ; H01Q1/00

Abstract:
A system including an inter-chip communication system is disclosed. One embodiment includes a base chip including a base chip transceiver network. At least one chip is stacked on the base chip, the at least one stacked chip including a substrate, a cavity formed in the substrate, a first surface, and a stacked chip transceiver network disposed on the first surface adjacent to the cavity.
Public/Granted literature
- US07710329B2 System including an inter-chip communication system Public/Granted day:2010-05-04
Information query
IPC分类: