Invention Application
US20090134489A1 SYSTEM INCLUDING AN INTER-CHIP COMMUNICATION SYSTEM 有权
系统包括互通通讯系统

SYSTEM INCLUDING AN INTER-CHIP COMMUNICATION SYSTEM
Abstract:
A system including an inter-chip communication system is disclosed. One embodiment includes a base chip including a base chip transceiver network. At least one chip is stacked on the base chip, the at least one stacked chip including a substrate, a cavity formed in the substrate, a first surface, and a stacked chip transceiver network disposed on the first surface adjacent to the cavity.
Public/Granted literature
Information query
Patent Agency Ranking
0/0