发明申请
US20090139758A1 Printed circuit board assembly and manufacturing method for the same
审中-公开
印刷电路板组装及制造方法相同
- 专利标题: Printed circuit board assembly and manufacturing method for the same
- 专利标题(中): 印刷电路板组装及制造方法相同
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申请号: US12155401申请日: 2008-06-03
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公开(公告)号: US20090139758A1公开(公告)日: 2009-06-04
- 发明人: Hyo Young Shin , Seung Boo Jung , Young Jun Moon , Soon Min Hong , Chang Yong Lee , Ja Myeong Koo , Hyun Tae Kim , Jong Bum Lee , Hyun Joo Han
- 申请人: Hyo Young Shin , Seung Boo Jung , Young Jun Moon , Soon Min Hong , Chang Yong Lee , Ja Myeong Koo , Hyun Tae Kim , Jong Bum Lee , Hyun Joo Han
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2007-122418 20071129
- 主分类号: H05K3/36
- IPC分类号: H05K3/36 ; H01R12/04
摘要:
A printed circuit board (PCB) assembly is disclosed, which includes a first PCB on which a plurality of first electrode terminals are arranged at intervals from one another; a second PCB on which a plurality of second electrode terminals respectively connected with the first electrode terminals are arranged at intervals from one another; and separation preventing member which prevents the first and the second electrode terminals from deviating from their correct positions when the first and the second electrode terminals are ultrasonically-welded to each other. Accordingly, lateral movement of the first and the second PCBs relative to each other is restricted owing to the separation preventing member, the plurality of first electrode terminals and second electrode terminals can be bonded to each other without deviating from their correct positions.
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