发明申请
US20090140408A1 INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT
审中-公开
集成电路封装系统，具有通过互连的堆叠
- 专利标题： INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH STACKING VIA INTERCONNECT
- 专利标题（中）： 集成电路封装系统，具有通过互连的堆叠
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申请号： US11948060申请日： 2007-11-30
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公开(公告)号： US20090140408A1公开(公告)日： 2009-06-04
- 发明人: Taewoo Lee , Sang-Ho Lee , Soo-San Park
- 申请人： Taewoo Lee , Sang-Ho Lee , Soo-San Park
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/58
摘要：
An integrated circuit package-on-package system includes: providing a bottom integrated circuit package system having a bottom substrate; mounting a top integrated circuit package system having a top substrate over the bottom integrated circuit package system; forming a top stacking via through the top substrate; forming a bottom stacking via into the bottom integrated circuit package system to the bottom substrate; and forming a stacking via interconnect with the top stacking via and the bottom stacking via aligned and connected.
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IPC分类:
