公开(公告)号：US20090140408A1

公开(公告)日：2009-06-04

申请号：US11948060

申请日：2007-11-30

申请人： Taewoo Lee ,  Sang-Ho Lee ,  Soo-San Park

发明人： Taewoo Lee ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L25/105 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/206

摘要： An integrated circuit package-on-package system includes: providing a bottom integrated circuit package system having a bottom substrate; mounting a top integrated circuit package system having a top substrate over the bottom integrated circuit package system; forming a top stacking via through the top substrate; forming a bottom stacking via into the bottom integrated circuit package system to the bottom substrate; and forming a stacking via interconnect with the top stacking via and the bottom stacking via aligned and connected.

摘要翻译： 集成电路封装封装系统包括：提供具有底部衬底的底部集成电路封装系统; 安装顶部集成电路封装系统，该系统在底部集成电路封装系统上具有顶部衬底; 通过顶部基板形成顶部堆叠通孔; 将底部堆叠通孔形成底部集成电路封装系统到底部基板; 以及通过经由对齐和连接的顶部堆叠通孔和底部堆叠的互连形成堆叠。

公开(公告)号：US20120319267A1

公开(公告)日：2012-12-20

申请号：US13163611

申请日：2011-06-17

申请人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

发明人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC分类号： H01L23/34 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L23/36 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a package stack assembly, having a contact pad, on the base substrate; applying an encapsulation having a cavity with a tapered side directly over the package stack assembly, the contact pad exposed in the cavity; attaching a recessed circuitry unit in the cavity and on the contact pad, a chamber of the cavity formed by the recessed circuitry unit and the tapered side of the cavity; and mounting a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 将具有接触垫的包装堆叠组件附接在所述基底基板上; 将具有锥形侧的空腔的封装直接施加在封装堆叠组件上方，该接触垫暴露在空腔中; 将凹陷的电路单元附接在所述空腔和所述接触垫上，所述凹腔由所述凹陷电路单元和所述空腔的锥形侧形成; 并将热结构安装在凹进的电路单元，空腔和封装之上。

公开(公告)号：US20110089554A1

公开(公告)日：2011-04-21

申请号：US12582582

申请日：2009-10-20

申请人： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

发明人： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L25/03 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在衬底上安装具有金属间化合物特性的端子的无基板集成电路封装; 连接基板和无基板集成电路封装; 以及在所述无衬底的集成电路封装上形成基底封装，所述端子暴露。

公开(公告)号：US08692365B2

公开(公告)日：2014-04-08

申请号：US13163611

申请日：2011-06-17

申请人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

发明人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/36 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a package stack assembly, having a contact pad, on the base substrate; applying an encapsulation having a cavity with a tapered side directly over the package stack assembly, the contact pad exposed in the cavity; attaching a recessed circuitry unit in the cavity and on the contact pad, a chamber of the cavity formed by the recessed circuitry unit and the tapered side of the cavity; and mounting a thermal structure over the recessed circuitry unit, the cavity, and the encapsulation.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供基底; 将具有接触垫的包装堆叠组件附接在所述基底基板上; 将具有锥形侧的空腔的封装直接施加在封装堆叠组件上方，该接触垫暴露在空腔中; 将凹陷的电路单元附接在所述空腔和所述接触垫上，所述凹腔由所述凹陷电路单元和所述空腔的锥形侧形成; 并将热结构安装在凹进的电路单元，空腔和封装之上。

公开(公告)号：US08390110B2

公开(公告)日：2013-03-05

申请号：US12582582

申请日：2009-10-20

申请人： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

发明人： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

IPC分类号： H01L23/48

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L25/03 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.

摘要翻译： 一种集成电路封装系统的制造方法，包括：在衬底上安装具有金属间化合物特性的端子的无基板集成电路封装; 连接基板和无基板集成电路封装; 以及在所述无衬底的集成电路封装上形成基底封装，所述端子暴露。

公开(公告)号：US08115293B2

公开(公告)日：2012-02-14

申请号：US12633789

申请日：2009-12-08

申请人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

发明人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC分类号： H01L21/60

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供第一基板; 将部件安装在所述第一基板上; 将堆叠衬底安装在所述部件上，所述堆叠衬底具有内衬垫和连接到所述第一衬底的外衬垫; 将第一暴露的互连件安装在所述外垫上; 在所述堆叠衬底上形成第一封装，所述第一暴露的互连部分暴露，并且所述内衬垫部分地暴露在所述第一封装的凹部中; 以及将第二暴露的互连件安装在所述内垫上。

公开(公告)号：US20110133325A1

公开(公告)日：2011-06-09

申请号：US12633789

申请日：2009-12-08

申请人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

发明人： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC分类号： H01L23/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/485

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供第一基板; 将部件安装在所述第一基板上; 将堆叠衬底安装在所述部件上，所述堆叠衬底具有内衬垫和连接到所述第一衬底的外衬垫; 将第一暴露的互连件安装在所述外垫上; 在所述堆叠衬底上形成第一封装，所述第一暴露的互连部分暴露，并且所述内衬垫部分地暴露在所述第一封装的凹部中; 以及将第二暴露的互连件安装在所述内垫上。

公开(公告)号：US08685797B2

公开(公告)日：2014-04-01

申请号：US13597086

申请日：2012-08-28

申请人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

发明人： Soo-San Park ,  Sang-Ho Lee ,  DaeSik Choi

IPC分类号： H01L21/00

CPC分类号： H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/36 ,  H01L23/49811 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a package carrier having a dispense port; attaching an integrated circuit to the package carrier and over the dispense port; placing a mold chase over the integrated circuit and on the package carrier, the mold chase having a hole; and forming an encapsulation through the dispense port or the hole, the encapsulation surrounding the integrated circuit including completely filled in a space between the integrated circuit and the package carrier, and in a portion of the hole, the encapsulation having an elevated portion or a removal surface resulting from the elevated portion detached.

摘要翻译： 一种制造集成电路封装系统的方法，包括：提供具有分配端口的封装载体; 将集成电路附接到包装载体和分配端口上; 将模具放置在集成电路上和封装载体上，模具具有孔; 并且通过所述分配端口或所述孔形成封装，所述集成电路周围的封装包括完全填充在所述集成电路和所述封装载体之间的空间中，并且在所述孔的一部分中，所述封装具有升高部分或去除 由升高的部分分离而产生的表面。

公开(公告)号：US20120261810A1

公开(公告)日：2012-10-18

申请号：US13536268

申请日：2012-06-28

申请人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

发明人： Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC分类号： H01L23/50

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01067 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device.

摘要翻译： 提供一种集成电路封装系统，包括：具有第一背面和第一主动侧的第一装置; 以及具有与所述第一装置的边缘相邻的所有四个角处精确配合的晶片间隔件以及沿着所述第一装置的边缘的凹部。

公开(公告)号：US08067307B2

公开(公告)日：2011-11-29

申请号：US12037291

申请日：2008-02-26

申请人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

发明人： DaeSik Choi ,  Sang-Ho Lee ,  Soo-San Park

IPC分类号： H01L21/44 ,  H01L23/28

CPC分类号： H01L23/3128 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06596 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die.

摘要翻译： 一种集成电路封装系统，包括：提供封装管芯; 以及将具有第一连接器端部的连接器引线与在封装模具上的突出的连接表面和降低的结构连接。