发明申请
US20090170037A1 COMPOSITION FOR REMOVING PHOTORESIST AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME
有权
用于去除光电元件的组合物和使用其制造阵列基板的方法
- 专利标题： COMPOSITION FOR REMOVING PHOTORESIST AND METHOD OF MANUFACTURING AN ARRAY SUBSTRATE USING THE SAME
- 专利标题（中）： 用于去除光电元件的组合物和使用其制造阵列基板的方法
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申请号： US12323649申请日： 2008-11-26
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公开(公告)号： US20090170037A1公开(公告)日： 2009-07-02
- 发明人: Jong-Hyun CHOUNG , Hong-Sick Park , Sun-Young Hong , Bong-Kyun Kim , Byeoung-Jin Lee , Byung-Uk Kim , Jong-Hyun Jeong , Suk-Il Yoon , Sung-Gun Shin , Soon-Beom Huh , Se-Hwan Jung , Doo-Young Jang
- 申请人： Jong-Hyun CHOUNG , Hong-Sick Park , Sun-Young Hong , Bong-Kyun Kim , Byeoung-Jin Lee , Byung-Uk Kim , Jong-Hyun Jeong , Suk-Il Yoon , Sung-Gun Shin , Soon-Beom Huh , Se-Hwan Jung , Doo-Young Jang
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2007-140687 20071228
- 主分类号： G03F7/20
- IPC分类号： G03F7/20 ; G03F7/42
摘要：
A composition for removing a photoresist includes a) an amine compound having a cyclic amine and/or a diamine, b) a glycol ether compound, c) a corrosion inhibitor and d) a polar solvent. The composition further includes a stripping promoter. Further disclosed is a method of manufacturing an array substrate using the composition for removing a photoresist.
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