发明申请
US20090174054A1 Module with Flat Construction and Method for Placing Components
审中-公开
具有扁平结构的模块和放置组件的方法
- 专利标题： Module with Flat Construction and Method for Placing Components
- 专利标题（中）： 具有扁平结构的模块和放置组件的方法
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申请号： US12352436申请日： 2009-01-12
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公开(公告)号： US20090174054A1公开(公告)日： 2009-07-09
- 发明人: Christian Block , Sebastian Brunner , Christian Hoffmann
- 申请人： Christian Block , Sebastian Brunner , Christian Hoffmann
- 优先权： DE102006033222.9 20060718
- 主分类号： H01L23/488
- IPC分类号： H01L23/488 ; H01L21/60
摘要：
A module for electrical components is proposed in which connection surfaces that can be bonded are provided on a multi-layer substrate with integrated wiring; a component chip is bonded on the top that has bond pads on its surface pointing upward and that contacts the substrate by means of bonding wires. Here, the wire guide of the bonding wires is so that they are each bonded with a ball on a connection surface and with the wedge directly on one of the bond pads.
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