发明申请
- 专利标题： Semiconductor Device
- 专利标题（中）： 半导体器件
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申请号： US12401491申请日： 2009-03-10
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公开(公告)号： US20090174061A1公开(公告)日： 2009-07-09
- 发明人: Yasuhiro NAKA , Tomio Iwasaki , Hidekazu Okuda , Yuji Fujii
- 申请人： Yasuhiro NAKA , Tomio Iwasaki , Hidekazu Okuda , Yuji Fujii
- 申请人地址： JP Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-255531 20040902
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/485
摘要：
To prevent peeling-off of a film in a solder connection pad of a semiconductor device, which peeling-off may occur due to thermal load and so on in the manufacture process, a pad structure is adopted in which a Cr film good in adhesiveness to either of a Ti film or Ti compound film and a Ni film (or a Cu film) is interposed between the Ti film or Ti compound film formed on a silicon or silicon oxide film, and the Ni film (or the Cu film) to be connected to solder. Further, to prevent peeling-off at the interface between the Ti film or Ti compound film and the silicon oxide film, the Cr film is formed in a larger area than the Ti film or Ti compound film.
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