Invention Application
- Patent Title: METHOD OF CONTROLLING PROCESS PARAMETERS FOR SEMICONDUCTOR MANUFACTURING APPARATUS
- Patent Title (中): 控制半导体制造装置工艺参数的方法
-
Application No.: US12052024Application Date: 2008-03-20
-
Publication No.: US20090177310A1Publication Date: 2009-07-09
- Inventor: Ritchie Dao , Derek Brodie , Scott Olszewski , Duy D. Nguyen , Chunlei Zhang
- Applicant: Ritchie Dao , Derek Brodie , Scott Olszewski , Duy D. Nguyen , Chunlei Zhang
- Main IPC: G06F17/00
- IPC: G06F17/00 ; G05D23/32

Abstract:
Methods and systems for adaptively controlling process parameters in semiconductor manufacturing equipment. An embodiment provides for gain scheduling of PID controllers across recipe steps. One embodiment provides a method for controlling a chuck temperature during a semiconductor manufacturing process, the method employing a first set of proportional-integral-derivative (PID) values in a PID controller to control the chuck temperature at a first setpoint in a first step of a process recipe and employing a second set of PID values in the PID controller to control the chuck temperature at a second setpoint, different than the first setpoint, in a second step of the process recipe. The methods and systems provide reduced controller response times where process parameter setpoint between steps of a process recipe span a wide range.
Public/Granted literature
- US07848840B2 Method of controlling process parameters for semiconductor manufacturing apparatus Public/Granted day:2010-12-07
Information query