发明申请
- 专利标题: METHOD OF CONTROLLING PROCESS PARAMETERS FOR SEMICONDUCTOR MANUFACTURING APPARATUS
- 专利标题(中): 控制半导体制造装置工艺参数的方法
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申请号: US12052024申请日: 2008-03-20
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公开(公告)号: US20090177310A1公开(公告)日: 2009-07-09
- 发明人: Ritchie Dao , Derek Brodie , Scott Olszewski , Duy D. Nguyen , Chunlei Zhang
- 申请人: Ritchie Dao , Derek Brodie , Scott Olszewski , Duy D. Nguyen , Chunlei Zhang
- 主分类号: G06F17/00
- IPC分类号: G06F17/00 ; G05D23/32
摘要:
Methods and systems for adaptively controlling process parameters in semiconductor manufacturing equipment. An embodiment provides for gain scheduling of PID controllers across recipe steps. One embodiment provides a method for controlling a chuck temperature during a semiconductor manufacturing process, the method employing a first set of proportional-integral-derivative (PID) values in a PID controller to control the chuck temperature at a first setpoint in a first step of a process recipe and employing a second set of PID values in the PID controller to control the chuck temperature at a second setpoint, different than the first setpoint, in a second step of the process recipe. The methods and systems provide reduced controller response times where process parameter setpoint between steps of a process recipe span a wide range.
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