公开(公告)号：US07848840B2

公开(公告)日：2010-12-07

申请号：US12052024

申请日：2008-03-20

申请人： Ritchie Dao ,  Derek Brodie ,  Scott Olszewski ,  Duy D Nguyen ,  Chunlei Zhang

发明人： Ritchie Dao ,  Derek Brodie ,  Scott Olszewski ,  Duy D Nguyen ,  Chunlei Zhang

IPC分类号： G06F19/00 ,  G05B13/00 ,  G05B11/42 ,  G05D23/00

CPC分类号： G05D23/1904 ,  G05B11/42 ,  H01L21/67098 ,  H01L21/67248

摘要： Methods and systems for adaptively controlling process parameters in semiconductor manufacturing equipment. An embodiment provides for gain scheduling of PID controllers across recipe steps. One embodiment provides a method for controlling a chuck temperature during a semiconductor manufacturing process, the method employing a first set of proportional-integral-derivative (PID) values in a PID controller to control the chuck temperature at a first setpoint in a first step of a process recipe and employing a second set of PID values in the PID controller to control the chuck temperature at a second setpoint, different than the first setpoint, in a second step of the process recipe. The methods and systems provide reduced controller response times where process parameter setpoint between steps of a process recipe span a wide range.

摘要翻译： 半导体制造设备中自动控制工艺参数的方法和系统。 一个实施例提供了PID控制器在配方步骤中的增益调度。 一个实施例提供了一种用于在半导体制造过程中控制卡盘温度的方法，该方法在PID控制器中采用第一组比例积分微分（PID）值来控制第一设定点的卡盘温度， 一个过程配方，并且在该PID控制器中采用第二组PID值来控制在第二设定点不同于第一设定点的卡盘温度。 方法和系统提供了减少的控制器响应时间，其中过程配方的步骤之间的过程参数设定范围广泛。

公开(公告)号：US20090177310A1

公开(公告)日：2009-07-09

申请号：US12052024

申请日：2008-03-20

申请人： Ritchie Dao ,  Derek Brodie ,  Scott Olszewski ,  Duy D. Nguyen ,  Chunlei Zhang

发明人： Ritchie Dao ,  Derek Brodie ,  Scott Olszewski ,  Duy D. Nguyen ,  Chunlei Zhang

IPC分类号： G06F17/00 ,  G05D23/32

CPC分类号： G05D23/1904 ,  G05B11/42 ,  H01L21/67098 ,  H01L21/67248

摘要： Methods and systems for adaptively controlling process parameters in semiconductor manufacturing equipment. An embodiment provides for gain scheduling of PID controllers across recipe steps. One embodiment provides a method for controlling a chuck temperature during a semiconductor manufacturing process, the method employing a first set of proportional-integral-derivative (PID) values in a PID controller to control the chuck temperature at a first setpoint in a first step of a process recipe and employing a second set of PID values in the PID controller to control the chuck temperature at a second setpoint, different than the first setpoint, in a second step of the process recipe. The methods and systems provide reduced controller response times where process parameter setpoint between steps of a process recipe span a wide range.

摘要翻译： 半导体制造设备中自动控制工艺参数的方法和系统。 一个实施例提供了PID控制器在配方步骤中的增益调度。 一个实施例提供了一种用于在半导体制造过程中控制卡盘温度的方法，该方法在PID控制器中采用第一组比例积分微分（PID）值来控制第一设定点的卡盘温度， 一个过程配方，并且在该PID控制器中采用第二组PID值来控制在第二设定点不同于第一设定点的卡盘温度。 方法和系统提供了减少的控制器响应时间，其中过程配方的步骤之间的过程参数设定范围广泛。