发明申请
US20090178832A1 PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND LOW DIELECTRIC TANGENT
有权
PREPREG及其低热膨胀和低介电常数的应用产品
- 专利标题： PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND LOW DIELECTRIC TANGENT
- 专利标题（中）： PREPREG及其低热膨胀和低介电常数的应用产品
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申请号： US12353357申请日： 2009-01-14
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公开(公告)号： US20090178832A1公开(公告)日： 2009-07-16
- 发明人: Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
- 申请人： Satoru Amou , Hiroshi Shimizu , Akinori Hanawa
- 专利权人： Hitachi Chemical Co.., Ltd.
- 当前专利权人： Hitachi Chemical Co.., Ltd.
- 优先权： JP2008-005620 20080115
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; B32B27/04
摘要：
A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100 ° C. is 50 ppm/° C. or less. A printed circuit board, multi layered circuit board, and electronic part are disclosed.