公开(公告)号：US08227361B2

公开(公告)日：2012-07-24

申请号：US12453029

申请日：2009-04-28

申请人： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

发明人： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC分类号： B32B17/02 ,  B32B27/04

CPC分类号： H05K1/0366 ,  C08J5/24 ,  H05K1/024 ,  H05K2201/012 ,  H05K2201/029 ,  Y10T442/2418 ,  Y10T442/2992

摘要： It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.

摘要翻译： 本发明的目的是提供一种降低介电损耗角正切，重量，厚度和成本的高频能力的印刷线路板材料，而不会影响可加工性，并提供使用其的电子部件。 本发明提供一种通过使用由低密度石英玻璃纤维构成的石英玻璃布作为基材并用具有低介电损耗角正切的热固性树脂组合物浸渍布而获得的预浸料，并且使用 预浸料作为绝缘层。

公开(公告)号：US08115105B2

公开(公告)日：2012-02-14

申请号：US12353357

申请日：2009-01-14

申请人： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

发明人： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC分类号： H05K1/00

CPC分类号： H05K1/0366 ,  B32B3/08 ,  B32B3/18 ,  B32B5/022 ,  B32B5/024 ,  B32B15/02 ,  B32B15/14 ,  B32B15/20 ,  B32B17/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0253 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/00 ,  B32B2457/04 ,  B32B2457/08 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T442/2475

摘要： A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100° C. is 50 ppm/° C. or less, is disclosed. A printed circuit board, multi layered circuit board, and electronic part are disclosed.

摘要翻译： 包含作为布的主要部分的由玻璃纤维和聚烯烃纤维组成的复合织布或无纺布的预浸料，以及提供具有低热膨胀系数的固化产物的热固性树脂组合物，其中， 在50〜100℃下的固化树脂组合物为50ppm /℃以下。 公开了印刷电路板，多层电路板和电子部件。

公开(公告)号：US20080261472A1

公开(公告)日：2008-10-23

申请号：US12105328

申请日：2008-04-18

申请人： Satoru AMOU ,  Hiroshi Shimizu ,  Akinori Hanawa

发明人： Satoru AMOU ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC分类号： B32B27/04 ,  B32B5/02 ,  D03D25/00

CPC分类号： D03D15/0011 ,  B32B15/08 ,  B32B27/04 ,  C08J5/24 ,  C08J2353/02 ,  D03D1/0082 ,  D03D15/00 ,  D03D15/0027 ,  D10B2101/06 ,  D10B2321/02 ,  D10B2321/021 ,  D10B2321/022 ,  D10B2401/041 ,  D10B2401/063 ,  D10B2505/02 ,  H05K1/0366 ,  H05K3/4626 ,  H05K2201/0158 ,  H05K2201/0278 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T442/2475 ,  Y10T442/30

摘要： A prepreg is thermosettable. The prepreg comprises a thermosetting resin composition A, a cured resin of the thermosetting resin composition exhibiting a dielectric tangent of 0.005 or less under 1 Hz or more, and a substrate B into which the resin A is impregnated, wherein the substrate B comprises polyolefin fiber C and a fiber D, which has a tensile strength higher than that of the polyolefin fiber C and a thermal expansion coefficient smaller than that of the fiber C, and wherein the substrate is a woven cloth and has a solubility rate into a hydrocarbon organic solvent is less than 5 wt %.

摘要翻译： 预浸料是热固性的。 预浸料坯包含热固性树脂组合物A，热固性树脂组合物的固化树脂在1Hz以上表现出0.005以下的介电切线和浸渍有树脂A的基材B，其中，基材B含有聚烯烃纤维 C和纤维D，其拉伸强度高于聚烯烃纤维C的拉伸强度，并且热膨胀系数小于纤维C的热膨胀系数，并且其中基材是织布并且具有溶解速率进入烃有机溶剂 小于5重量％。

公开(公告)号：US5238730A

公开(公告)日：1993-08-24

申请号：US717498

申请日：1991-06-19

申请人： Akinori Hanawa ,  Mitsuo Yokota ,  Akira Shimizu ,  Kazuyuki Tanaka ,  Yukihiko Yamashita

发明人： Akinori Hanawa ,  Mitsuo Yokota ,  Akira Shimizu ,  Kazuyuki Tanaka ,  Yukihiko Yamashita

IPC分类号： C08F290/12 ,  C08F299/02 ,  C08G59/30 ,  C08G59/42 ,  C08L63/10 ,  H05K1/03

CPC分类号： H05K1/0326 ,  C08F290/126 ,  C08F299/026 ,  C08G59/30 ,  C08G59/4292 ,  C08L63/10 ,  Y10T442/2213 ,  Y10T442/2475 ,  Y10T442/2549 ,  Y10T442/2672 ,  Y10T442/2713

摘要： A thermosetting resin composition comprising (A) a dibasic acid modified epoxy (meth)acrylate resin obtained by reacting a bromine-containing epoxy resin with a dibasic acid of 4 or more carbon atoms followed by further reacting with acrylic acid or methacrylic acid, (B) a thermosetting resin having an unsaturated group, the unsaturated group being copolymerizable with the resin (A), and (C) a polymerizable monomer; and an electrical laminate produced by using the thermosetting resin composition are disclosed.

摘要翻译： 一种热固性树脂组合物，其包含（A）通过使含溴环氧树脂与碳原子数为4以上的二元酸反应而获得的二元酸改性环氧（甲基）丙烯酸酯树脂，然后与丙烯酸或甲基丙烯酸进一步反应，（B ）具有不饱和基团的热固性树脂，不饱和基团可与树脂（A）共聚，和（C）可聚合单体; 并且公开了通过使用该热固性树脂组合物制造的电气层压板。

公开(公告)号：US20090178832A1

公开(公告)日：2009-07-16

申请号：US12353357

申请日：2009-01-14

申请人： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

发明人： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC分类号： H05K1/03 ,  B32B27/04

CPC分类号： H05K1/0366 ,  B32B3/08 ,  B32B3/18 ,  B32B5/022 ,  B32B5/024 ,  B32B15/02 ,  B32B15/14 ,  B32B15/20 ,  B32B17/02 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0253 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/306 ,  B32B2307/714 ,  B32B2457/00 ,  B32B2457/04 ,  B32B2457/08 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T442/2475

摘要： A prepreg comprising composite woven cloth or non-woven cloth composed of glass fiber and polyolefin fiber that are a main part of the cloth and a thermosetting resin composition that gives a cured product having a low thermal expansion coefficient, wherein the thermal expansion coefficient of the cured resin composition at 50 to 100 ° C. is 50 ppm/° C. or less. A printed circuit board, multi layered circuit board, and electronic part are disclosed.

摘要翻译： 包含作为布的主要部分的由玻璃纤维和聚烯烃纤维组成的复合织布或无纺布的预浸料，以及提供具有低热膨胀系数的固化产物的热固性树脂组合物，其中， 50〜100℃的固化树脂组合物为50ppm /℃以下。 公开了印刷电路板，多层电路板和电子部件。

公开(公告)号：US06749899B2

公开(公告)日：2004-06-15

申请号：US10220426

申请日：2002-09-03

申请人： Takeshi Saitou ,  Akinori Hanawa ,  Takashi Matsuzaki ,  Morimichi Sudou

发明人： Takeshi Saitou ,  Akinori Hanawa ,  Takashi Matsuzaki ,  Morimichi Sudou

IPC分类号： B05D302

CPC分类号： C08J5/24 ,  B29B15/125 ,  H05K3/022 ,  Y10T428/24917

摘要： There are disclosed a method of preparing a prepreg comprising the steps of a impregnation process in which a thermosetting resin varnish is impregnated into a fiber base material and a drying step in which a solvent of the impregnated thermosetting resin varnish in the fiber base material is vaporized and the resin is semi-cured, wherein the drying step is carried out by moving the fiber base material into which the thermosetting resin varnish is impregnated with a tensile force of 3.0 N/cm or less; and a prepreg prepared by the method.

摘要翻译： 公开了一种制备预浸料的方法，包括以下步骤：将热固性树脂清漆浸渍在纤维基材中的浸渍方法和干燥步骤，其中纤维基材中浸渍的热固性树脂清漆的溶剂蒸发 树脂半固化，其中干燥步骤是通过以3.0N / cm或更小的张力移动浸渍有热固性树脂清漆的纤维基材来进行的; 和通过该方法制备的预浸料。

公开(公告)号：US5009949A

公开(公告)日：1991-04-23

申请号：US194918

申请日：1988-05-17

申请人： Kazuyuki Tanaka ,  Etsuji Iwami ,  Jun Matsuzawa ,  Yoshiyuki Mukoyama ,  Norihiko Shibata ,  Akinori Hanawa ,  Mitsuo Yokota

发明人： Kazuyuki Tanaka ,  Etsuji Iwami ,  Jun Matsuzawa ,  Yoshiyuki Mukoyama ,  Norihiko Shibata ,  Akinori Hanawa ,  Mitsuo Yokota

IPC分类号： C08F265/04 ,  C08F290/12 ,  C08J5/24 ,  H05K1/03

CPC分类号： C08J5/24 ,  C08F265/04 ,  C08F290/12 ,  H05K1/0326 ,  C08J2351/00 ,  Y10T442/2475 ,  Y10T442/2746

摘要： A resin composition comprising a copolymer (A) having carbon-carbon unsaturated bonds in its side chains, particularly that obtained by reacting a copolymer of alkyl (meth)arylate (0-50 mole %), hydroxy (meth)acrylate (10-50 mole %) and ethylenic unsaturated monomer (0 to 90 mole %) with an unsaturated carboxylic acid or an anhydride thereof, and a monomer (B) copolymerizable with (A) is suitable for producing a laminate for electrical use.

公开(公告)号：US08097545B2

公开(公告)日：2012-01-17

申请号：US11867091

申请日：2007-10-04

申请人： Satoru Amou ,  Haruo Akahoshi ,  Hiroshi Shimizu ,  Akinori Hanawa

发明人： Satoru Amou ,  Haruo Akahoshi ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC分类号： B32B27/04 ,  B32B27/00

CPC分类号： B32B5/02 ,  B32B27/04 ,  C08F290/06 ,  C08K5/0025 ,  C08L53/02 ,  C08L53/025 ,  H05K1/032 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/31757 ,  Y10T442/2631 ,  Y10T442/2738 ,  C08L2666/02

摘要： It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same.This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80° C. to 140° C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170° C. to 230° C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.

摘要翻译： 本发明的目的是获得：通过控制1,2-聚丁二烯树脂组合物的相分离而不会在高频区域表现出的介电性能降低，从而加工性，介电特性，耐热性和粘合性优异; 和使用其的多层印刷线路板。 本发明涉及一种聚丁二烯树脂组合物，其包含：交联组分（A），其包含由下式（1）表示的数均分子量为1000至20000的重复单元; 自由基聚合引发剂（B），其一分钟半衰期温度为80℃至140℃; 和自由基聚合引发剂（C），其一分钟的半衰期温度为170℃至230℃; 相对于100重量份的成分（A），含有3〜10重量份的成分（B）和5〜15重量份的成分（C）。 本发明还涉及使用其制造的预浸料坯，层压板和印刷线路板。

公开(公告)号：US20090266591A1

公开(公告)日：2009-10-29

申请号：US12453029

申请日：2009-04-28

申请人： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

发明人： Satoru Amou ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC分类号： H05K1/02 ,  B32B5/00

CPC分类号： H05K1/0366 ,  C08J5/24 ,  H05K1/024 ,  H05K2201/012 ,  H05K2201/029 ,  Y10T442/2418 ,  Y10T442/2992

摘要： It is an object of the present invention to provide a high frequency-capable printed wiring board material reduced in the dielectric loss tangent, weight, thickness and cost without compromising the workability, and provide electronic components using the same. The present invention provides a prepreg obtained by using a quartz glass cloth composed of low-density quartz glass fibers as a base material and impregnating the cloth with a thermosetting resin composition having a low dielectric loss tangent, and provides electronic components using a cured product of the prepreg as an insulating layer.

摘要翻译： 本发明的目的是提供一种降低介电损耗角正切，重量，厚度和成本的高频能力的印刷线路板材料，而不会影响可加工性，并提供使用其的电子部件。 本发明提供一种通过使用由低密度石英玻璃纤维构成的石英玻璃布作为基材并用具有低介电损耗角正切的热固性树脂组合物浸渍布而获得的预浸料，并且使用 预浸料作为绝缘层。

公开(公告)号：US20080090478A1

公开(公告)日：2008-04-17

申请号：US11867091

申请日：2007-10-04

申请人： Satoru Amou ,  Haruo Akahoshi ,  Hiroshi Shimizu ,  Akinori Hanawa

发明人： Satoru Amou ,  Haruo Akahoshi ,  Hiroshi Shimizu ,  Akinori Hanawa

IPC分类号： B32B5/02 ,  B05D3/06 ,  C08F236/06 ,  C08F290/06 ,  C08F4/32 ,  C08K5/34

CPC分类号： B32B5/02 ,  B32B27/04 ,  C08F290/06 ,  C08K5/0025 ,  C08L53/02 ,  C08L53/025 ,  H05K1/032 ,  H05K1/0373 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0158 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/31757 ,  Y10T442/2631 ,  Y10T442/2738 ,  C08L2666/02

摘要： It is an objective of this invention to obtain: a composition superior in processability, dielectric properties, heat resistance, and adhesiveness by controlling phase separation of a 1,2-polybutadiene resin composition without deterioration of dielectric properties exhibited in high-frequency regions; and a multilayer printed wiring board using the same. This invention relates to a polybutadiene resin composition, comprising: a crosslinking component (A) comprising repeating units represented by the following formula (1) and having a number average molecular weight of 1000 to 20000; a radical polymerization initiator (B), the one-minute half-life temperature of which is 80° C. to 140° C.; and a radical polymerization initiator (C), the one-minute half-life temperature of which is 170° C. to 230° C.; wherein 3 to 10 parts by weight of the component (B) and 5 to 15 parts by weight of the component (C) are contained relative to 100 parts by weight of the component (A). The invention also relates to a prepreg, a laminate, and a printed wiring board, which are produced using the same.

摘要翻译： 本发明的目的是获得：通过控制1,2-聚丁二烯树脂组合物的相分离而不会在高频区域表现出的介电性能降低，从而加工性，介电特性，耐热性和粘合性优异; 和使用其的多层印刷线路板。 本发明涉及一种聚丁二烯树脂组合物，其包含：交联组分（A），其包含由下式（1）表示的数均分子量为1000至20000的重复单元; 自由基聚合引发剂（B），其一分钟半衰期温度为80℃至140℃; 和自由基聚合引发剂（C），其一分钟的半衰期温度为170℃至230℃; 相对于100重量份的成分（A），含有3〜10重量份的成分（B）和5〜15重量份的成分（C）。 本发明还涉及使用其制造的预浸料坯，层压板和印刷线路板。