发明申请
- 专利标题： METHOD OF FABRICATING SOLDER BUMPS
- 专利标题（中）： 制造焊膏的方法
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申请号： US12015447申请日： 2008-01-16
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公开(公告)号： US20090181223A1公开(公告)日： 2009-07-16
- 发明人: Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
- 申请人： Stephen L. Buchwalter , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
- 申请人地址： US NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： US NY Armonk
- 主分类号： B23K31/02
- IPC分类号： B23K31/02 ; B32B3/10
摘要：
A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different solders with different melting temperatures. A method of fabricating the solder is included.
公开/授权文献
- US07838954B2 Semiconductor structure with solder bumps 公开/授权日：2010-11-23
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