发明申请
US20090186955A1 ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
审中-公开
粘合组合物,其制造方法,使用该粘合剂的胶片,用于安装半导体和半导体器件的基板
- 专利标题: ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, ADHESIVE FILM USING THE SAME, SUBSTRATE FOR MOUNTING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE
- 专利标题(中): 粘合组合物,其制造方法,使用该粘合剂的胶片,用于安装半导体和半导体器件的基板
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申请号: US12414420申请日: 2009-03-30
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公开(公告)号: US20090186955A1公开(公告)日: 2009-07-23
- 发明人: Teiichi INADA , Keiji Sumiya , Takeo Tomiyama , Tetsurou Iwakura , Hiroyuki Kawakami , Masao Suzuki , Takayuki Matsuzaki , Youichi Hosokawa , Keiichi Hatakeyama , Yasushi Shimada , Yuuko Tanaka , Hiroyuki Kuriya
- 申请人: Teiichi INADA , Keiji Sumiya , Takeo Tomiyama , Tetsurou Iwakura , Hiroyuki Kawakami , Masao Suzuki , Takayuki Matsuzaki , Youichi Hosokawa , Keiichi Hatakeyama , Yasushi Shimada , Yuuko Tanaka , Hiroyuki Kuriya
- 优先权: JP2000-41346 20000215; JP2000-349737 20001116; JP2000-349739 20001116
- 主分类号: C08L63/00
- IPC分类号: C08L63/00 ; C08J9/00
摘要:
The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the fillers followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.