公开(公告)号：US09611214B2

公开(公告)日：2017-04-04

申请号：US14300619

申请日：2014-06-10

申请人： Muneaki Kurimura ,  Shinichi Taira ,  Takahiro Tomoyasu ,  Nobuaki Ito ,  Kuninori Tai ,  Noriaki Takemura ,  Takayuki Matsuzaki ,  Yasuhiro Menjo ,  Shin Miyamura ,  Yohji Sakurai ,  Akihito Watanabe ,  Yasuyo Sakata ,  Takumi Masumoto ,  Kohei Akazawa ,  Haruhiko Sugino ,  Naoki Amada ,  Satoshi Ohashi ,  Tomoichi Shinohara ,  Hirofumi Sasaki ,  Chisako Morita ,  Junko Yamashita ,  Satoko Nakajima

发明人： Muneaki Kurimura ,  Shinichi Taira ,  Takahiro Tomoyasu ,  Nobuaki Ito ,  Kuninori Tai ,  Noriaki Takemura ,  Takayuki Matsuzaki ,  Yasuhiro Menjo ,  Shin Miyamura ,  Yohji Sakurai ,  Akihito Watanabe ,  Yasuyo Sakata ,  Takumi Masumoto ,  Kohei Akazawa ,  Haruhiko Sugino ,  Naoki Amada ,  Satoshi Ohashi ,  Tomoichi Shinohara ,  Hirofumi Sasaki ,  Chisako Morita ,  Junko Yamashita ,  Satoko Nakajima

IPC分类号： C07D207/14 ,  C07D401/12 ,  C07D403/12 ,  C07D405/12 ,  C07D409/12 ,  C07D413/12 ,  C07D417/12 ,  C07D401/14 ,  C07D471/04 ,  C07D495/04 ,  C07D413/14 ,  C07F7/10

CPC分类号： C07D205/04 ,  C07D207/14 ,  C07D401/12 ,  C07D401/14 ,  C07D403/12 ,  C07D405/12 ,  C07D405/14 ,  C07D409/12 ,  C07D409/14 ,  C07D413/12 ,  C07D413/14 ,  C07D417/12 ,  C07D471/04 ,  C07D495/04 ,  C07F7/10

摘要： The present invention provides a pyrrolidine compound of General Formula (1) or a salt thereof, wherein R101 and R102 are each independently a phenyl group or a pyridyl group, the phenyl group or the pyridyl group may have one or more substituents selected from halogen atoms and lower alkyl groups optionally substituted with one or more halogen atoms, etc. The pyrrolidine compound or a salt thereof of the present invention is usable to produce a pharmaceutical preparation having a wider therapeutic spectrum and being capable of exhibiting sufficient therapeutic effects after short-term administration.

公开(公告)号：USD690278S1

公开(公告)日：2013-09-24

申请号：US29413539

申请日：2012-02-16

申请人： Kouhei Taniguchi ,  Takayuki Matsuzaki ,  Shinya Katou ,  Kouji Komorida ,  Michio Mashino ,  Tatsuya Sakuta ,  Rie Katou

设计人： Kouhei Taniguchi ,  Takayuki Matsuzaki ,  Shinya Katou ,  Kouji Komorida ,  Michio Mashino ,  Tatsuya Sakuta ,  Rie Katou

公开(公告)号：US08470115B2

公开(公告)日：2013-06-25

申请号：US13310515

申请日：2011-12-02

申请人： Maiko Tanaka ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

发明人： Maiko Tanaka ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

IPC分类号： B29C65/50 ,  B32B37/14 ,  B32B38/10 ,  B32B38/04

CPC分类号： H01L24/28 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2224/26175 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1476 ,  Y10T428/24562 ,  Y10T428/2839 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.

公开(公告)号：US08465615B2

公开(公告)日：2013-06-18

申请号：US13310531

申请日：2011-12-02

申请人： Maiko Tanaka ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

发明人： Maiko Tanaka ,  Michio Uruno ,  Takayuki Matsuzaki ,  Ryoji Furutani ,  Michio Mashino ,  Teiichi Inada

IPC分类号： B29C65/50 ,  B32B37/14 ,  B32B38/04 ,  B32B38/10

CPC分类号： H01L24/28 ,  C09J7/20 ,  C09J2201/28 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6839 ,  H01L2224/26175 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/7565 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2225/0651 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10T156/1082 ,  Y10T156/1093 ,  Y10T428/1476 ,  Y10T428/24562 ,  Y10T428/2839 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： An adhesive sheet comprising a release substrate 10, a substrate film 14, and a first tacky-adhesive layer 12 placed between the release substrate 10 and the substrate film 14, wherein an annular incision D is formed on the release substrate 10 from the surface of the first tacky-adhesive layer 12 side, the first tacky-adhesive layer 12 is laminated so as to cover the whole inner surface of the incision D in the release substrate 10, and the incision D has a depth d of less than the thickness of the release substrate 10 and 25 μm or less.

摘要翻译： 一种粘合片，其包括放置在剥离基板10和基材膜14之间的剥离基板10，基材膜14和第一粘性层12，其中环状切口D从剥离基板10的表面形成 第一粘合剂层12侧，第一粘合剂层12层叠以覆盖剥离基板10中的切口D的整个内表面，并且切口D的深度d小于 释放基板10和25或更小。

公开(公告)号：US20130143390A1

公开(公告)日：2013-06-06

申请号：US13809816

申请日：2011-07-13

申请人： Rie Katou ,  Takayuki Matsuzaki ,  Shinya Katou ,  Ryoji Furutani ,  Tatsuya Sakuta ,  Kouji Komorida

发明人： Rie Katou ,  Takayuki Matsuzaki ,  Shinya Katou ,  Ryoji Furutani ,  Tatsuya Sakuta ,  Kouji Komorida

IPC分类号： H01L21/683 ,  H01L21/78

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  H01L21/67092 ,  H01L21/67132 ,  H01L21/78 ,  H01L2221/68327 ,  H01L2221/68377 ,  Y10T156/1062 ,  Y10T428/21

摘要： A dicing/die bonding integral film of the present invention includes a base film, a pressure-sensitive adhesive layer which is formed on the base film and to which a wafer ring for blade dicing is bonded, and a bonding layer formed on the adhesive layer and having a central portion to which a semiconductor wafer to be diced is bonded, wherein a planar shape of the bonding layer is circular, an area of the bonding layer is greater than an area of the semiconductor wafer and smaller than an area of each of the base film and the adhesive layer, and a diameter of the bonding layer is greater than a diameter of the semiconductor wafer and less than an inner diameter of the wafer ring, and a difference in diameter between the bonding layer and the semiconductor wafer is greater than 20 mm and less than 35 mm,

摘要翻译： 本发明的切割/裸片接合一体膜包括基膜，形成在基膜上并且用于切割用于切片的晶片环的粘合剂层和形成在粘合剂层上的粘合层 并且具有要被切割的半导体晶片被接合的中心部分，其中所述接合层的平面形状是圆形的，所述接合层的面积大于所述半导体晶片的面积，并且小于所述半导体晶片的面积 基底膜和粘合剂层，并且接合层的直径大于半导体晶片的直径并且小于晶片环的内径，并且接合层和半导体晶片之间的直径差较大 大于20mm且小于35mm，

公开(公告)号：US20120094471A1

公开(公告)日：2012-04-19

申请号：US13274288

申请日：2011-10-14

申请人： Kouhei TANIGUCHI ,  Takayuki Matsuzaki ,  Shinya Katou ,  Kouji Komorida ,  Michio Mashino ,  Tatsuya Sakuta ,  Rie Katou

发明人： Kouhei TANIGUCHI ,  Takayuki Matsuzaki ,  Shinya Katou ,  Kouji Komorida ,  Michio Mashino ,  Tatsuya Sakuta ,  Rie Katou

IPC分类号： H01L21/78 ,  B32B37/14 ,  B32B33/00 ,  B32B37/12

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J7/403 ,  C09J2201/122 ,  C09J2201/20 ,  C09J2201/28 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2203/326 ,  H01L21/568 ,  H01L21/67132 ,  H01L21/78 ,  H01L23/3135 ,  H01L2924/0002 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/1476 ,  H01L2924/00

摘要： In a wafer processing tape, circular or tongue-shaped notched parts facing the center of an adhesive layer, as seen in a plan view, are formed so as to correspond to a pasting region to a wafer ring to a depth that reaches a release base material from the side of a base material film. Due to the formation of the notched parts, when a peeling force acts on the wafer processing tape, portions of a tacky material layer and the base material film which are more outward than the notched parts are peeled off first, and a portion that is more inward than the notched parts remains on the wafer ring in a protruding state. Accordingly, a peeling strength between the wafer processing tape and the wafer ring can be increased. Methods of manufacturing the tape and a semiconductor device are also provided.

摘要翻译： 在晶片处理带中，如平面图所示，面对粘合剂层的中心的圆形或舌形切口部分形成为对应于到晶片环的粘贴区域到达到释放基底的深度 材料从基材膜的侧面。 由于形成切口部分，当剥离力作用在晶片处理带上时，首先剥离比缺口部分更向外的粘性材料层和基材膜的部分，并且更多的部分 向内比缺口部分保持在晶片环上处于突出状态。 因此，可以提高晶片处理带和晶片环之间的剥离强度。 还提供了制造带和半导体器件的方法。

公开(公告)号：USD656909S1

公开(公告)日：2012-04-03

申请号：US29389788

申请日：2011-04-15

申请人： Kouhei Taniguchi ,  Takayuki Matsuzaki ,  Shinya Katou ,  Kouji Komorida ,  Michio Mashino ,  Tatsuya Sakuta ,  Rie Katou

设计人： Kouhei Taniguchi ,  Takayuki Matsuzaki ,  Shinya Katou ,  Kouji Komorida ,  Michio Mashino ,  Tatsuya Sakuta ,  Rie Katou

公开(公告)号：US20120065162A1

公开(公告)日：2012-03-15

申请号：US13298336

申请日：2011-11-17

申请人： Muneaki KURIMURA ,  Shinichi TAIRA ,  Takahiro TOMOYASU ,  Nobuaki ITO ,  Kuninori TAI ,  Noriaki TAKEMURA ,  Takayuki MATSUZAKI ,  Yasuhiro MENJO ,  Shin MIYAMURA ,  Yohji SAKURAI ,  Akihito WATANABE ,  Yasuyo SAKATA ,  Takumi MASUMOTO ,  Kohei AKAZAWA ,  Haruhiko SUGINO ,  Naoki AMADA ,  Satoshi OHASHI ,  Tomoichi SHINOHARA ,  Hirofumi SASAKI ,  Chisako MORITA ,  Junko YAMASHITA ,  Satoko NAKAJIMA

发明人： Muneaki KURIMURA ,  Shinichi TAIRA ,  Takahiro TOMOYASU ,  Nobuaki ITO ,  Kuninori TAI ,  Noriaki TAKEMURA ,  Takayuki MATSUZAKI ,  Yasuhiro MENJO ,  Shin MIYAMURA ,  Yohji SAKURAI ,  Akihito WATANABE ,  Yasuyo SAKATA ,  Takumi MASUMOTO ,  Kohei AKAZAWA ,  Haruhiko SUGINO ,  Naoki AMADA ,  Satoshi OHASHI ,  Tomoichi SHINOHARA ,  Hirofumi SASAKI ,  Chisako MORITA ,  Junko YAMASHITA ,  Satoko NAKAJIMA

IPC分类号： A61K31/695 ,  A61K31/40 ,  C07D403/12 ,  C07D239/24 ,  C07D401/12 ,  A61K31/501 ,  A61K31/506 ,  C07D491/04 ,  A61K31/519 ,  C07D265/36 ,  A61K31/538 ,  C07D241/10 ,  A61K31/497 ,  C07F7/10 ,  A61P9/12 ,  A61P25/18 ,  A61P25/24 ,  A61P25/30 ,  A61P25/22 ,  A61P25/28 ,  A61P25/00 ,  A61P25/16 ,  C07D207/12

CPC分类号： C07D205/04 ,  C07D207/14 ,  C07D401/12 ,  C07D401/14 ,  C07D403/12 ,  C07D405/12 ,  C07D405/14 ,  C07D409/12 ,  C07D409/14 ,  C07D413/12 ,  C07D413/14 ,  C07D417/12 ,  C07D471/04 ,  C07D495/04 ,  C07F7/10

摘要： The present invention provides a pyrrolidine compound of General Formula (1) or a salt thereof, wherein R101 and R102 are each independently a phenyl group or a pyridyl group, the phenyl group or the pyridyl group may have one or more substituents selected from halogen atoms and lower alkyl groups optionally substituted with one or more halogen atoms, etc. The pyrrolidine compound or a salt thereof of the present invention is usable to produce a pharmaceutical preparation having a wider therapeutic spectrum and being capable of exhibiting sufficient therapeutic effects after short-term administration.

摘要翻译： 本发明提供通式（1）的吡咯烷化合物或其盐，其中R 101和R 102各自独立地为苯基或吡啶基，苯基或吡啶基可以具有一个或多个选自卤素原子的取代基 和任选被一个或多个卤素原子取代的低级烷基等。本发明的吡咯烷化合物或其盐可用于制备具有较宽治疗谱的药物制剂，并能在短期内表现出足够的治疗效果 行政。

公开(公告)号：US20110187006A1

公开(公告)日：2011-08-04

申请号：US13084773

申请日：2011-04-12

申请人： Teiichi INADA ,  Keiji SUMIYA ,  Takeo TOMIYAMA ,  Tetsurou IWAKURA ,  Hiroyuki KAWAKAMI ,  Masao SUZUKI ,  Takayuki MATSUZAKI ,  Youichi HOSOKAWA ,  Keiichi HATAKEYAMA ,  Yasushi SHIMADA ,  Yuuko TANAKA ,  Hiroyuki KURIYA

发明人： Teiichi INADA ,  Keiji SUMIYA ,  Takeo TOMIYAMA ,  Tetsurou IWAKURA ,  Hiroyuki KAWAKAMI ,  Masao SUZUKI ,  Takayuki MATSUZAKI ,  Youichi HOSOKAWA ,  Keiichi HATAKEYAMA ,  Yasushi SHIMADA ,  Yuuko TANAKA ,  Hiroyuki KURIYA

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

公开(公告)号：US20090186955A1

公开(公告)日：2009-07-23

申请号：US12414420

申请日：2009-03-30

申请人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

发明人： Teiichi INADA ,  Keiji Sumiya ,  Takeo Tomiyama ,  Tetsurou Iwakura ,  Hiroyuki Kawakami ,  Masao Suzuki ,  Takayuki Matsuzaki ,  Youichi Hosokawa ,  Keiichi Hatakeyama ,  Yasushi Shimada ,  Yuuko Tanaka ,  Hiroyuki Kuriya

IPC分类号： C08L63/00 ,  C08J9/00

CPC分类号： H01L23/14 ,  C08G59/18 ,  C08L2666/02 ,  C08L2666/04 ,  C09J7/10 ,  C09J7/35 ,  C09J163/00 ,  C09J2205/102 ,  C09J2433/00 ,  C09J2463/00 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3114 ,  H01L23/3737 ,  H01L23/564 ,  H01L2224/50 ,  H01L2924/01019 ,  H01L2924/01068 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15311 ,  H05K1/0271 ,  Y10T156/1089 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/31511

摘要： The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the epoxy resin and (b) the curing agent with (d) the fillers followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film comprising the above-mentioned adhesive composition formed into a film; a substrate for mounting semiconductor comprising a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which comprises the above-mentioned adhesive film or the substrate for mounting semiconductor.

摘要翻译： 本发明提供了一种粘合剂组合物，其包含（a）环氧树脂，（b）固化剂和（c）与所述环氧树脂不相容的高分子化合物，并且还任选地包含（d）填料和/或（e） 固化促进剂; 一种制备粘合剂组合物的方法，包括：（a）环氧树脂和（b）固化剂与（d）填料混合，然后将所得混合物与（c）与环氧树脂不相容的高分子化合物混合; 包含形成为膜的上述粘合剂组合物的粘合膜; 一种用于安装半导体的基板，包括布线板和其上安装有芯片的侧面上的粘合膜; 以及包括上述粘合膜或用于安装半导体的基板的半导体器件。